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Laser processing system, laser processing method and method of obtaining oval light spot

An elliptical spot, laser processing technology, applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of uneven section, large section taper, brittle material edge collapse, etc.

Pending Publication Date: 2021-12-10
深圳市大族半导体装备科技有限公司
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Problems solved by technology

[0003] However, in conventional laser processing technology, Gaussian beams are often used for drilling and cutting operations. Irregular cracks usually occur on both sides of the cutting line formed by Gaussian beam cutting. Because the cracks are uncontrollable, it will further lead to brittle materials. Chipping occurs during the process; moreover, the cross-section obtained by Gaussian beam cutting has a large taper, making the cross-section uneven

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  • Laser processing system, laser processing method and method of obtaining oval light spot
  • Laser processing system, laser processing method and method of obtaining oval light spot
  • Laser processing system, laser processing method and method of obtaining oval light spot

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Embodiment Construction

[0027] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0028] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counte...

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Abstract

The invention relates to a laser processing system, a laser processing method and a method of obtaining an oval light spot. In the laser processing system, by arranging a first phase modulation element and a second phase modulation element to modulate a phase of a light beam, after the light beam is focused by a first focusing unit, the light beam irradiates a to-be-processed workpiece to form the oval light spot with a large focal depth, a crack is more easily formed in a long axis direction of the oval light spot, and a direction of the crack can be controlled only by reasonably controlling the long axis direction of the oval light spot, so that the crack develops in a direction beneficial to cutting the to-be-processed workpiece , and the edge breakage phenomenon of the to-be-workpiece is not prone to occurring; and in addition, a first cutting light beam is in penetrative energy distribution in the to-be-processed workpiece in a light propagation direction, so that a cutting channel is more uniform, the taper is relatively small, and the cutting section is smoother.

Description

technical field [0001] The invention relates to the technical field of laser processing, in particular to a laser processing system, a laser processing method and a method for obtaining an elliptical spot. Background technique [0002] Laser processing is widely used in the processing of transparent and brittle materials such as sapphire and glass because of its non-contact, simple operation, and high flexibility. [0003] However, in conventional laser processing technology, Gaussian beams are often used for drilling and cutting operations. Irregular cracks usually occur on both sides of the cutting line formed by Gaussian beam cutting. Because the cracks are uncontrollable, it will further lead to brittle materials. Edge chipping occurs during the process; moreover, the cross-section obtained by Gaussian beam cutting has a large taper, which makes the cross-section uneven. Contents of the invention [0004] Based on this, it is necessary to provide a laser processing sy...

Claims

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Application Information

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IPC IPC(8): B23K26/38B23K26/402B23K26/073B23K26/064
CPCB23K26/38B23K26/402B23K26/0736B23K26/064B23K26/0643B23K26/0652B23K2103/50B23K2103/54
Inventor 张小军任莉娜李一龄曾志刚卢建刚邱越渭苑学瑞孙杰尹建刚高云峰
Owner 深圳市大族半导体装备科技有限公司
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