Hard connection implementation method of optical module and optical module

Abstract

The invention relates to a hard connection implementation method of an optical module and the optical module, and the method comprises the steps: carrying out the hard connection, carrying out the integrated assembly of a PCBA and an optical device, and then carrying out the surface mounting of internal key elements, thereby avoiding the obvious dislocation of an optical path or a circuit; carrying out key high-frequency interconnection, carrying out light path interconnection by utilizing the characteristic that parallel light paths are insensitive to axial deviation and transverse deviation, forming a non-positive-sequence implementation method, thus the advantage of large light spot coupling tolerance can be compatible, each channel can be kept to be coupled to the optimal tolerance curve position, and meanwhile, the device is simple in structure, the coupling method is easy to control, and has the advantages of small occupied space, easy assembly and the like.

Description

technical field [0001] The invention belongs to the technical field of optical communication, and in particular relates to a hard connection realization method of an optical module and the optical module. Background technique [0002] For many miniaturized optical modules, such as SFP+ optical modules, QSFP+ optical modules, QSFP28 optical modules, etc., the optical device is assembled in the module by bending the TO pin of the optical device through a soft tape or assembled with the PCBA. , this method is common in the application of airtight optical devices, such as patents with application numbers CN201711243548.9, CN201710833529.5, CN201921371832.9, etc.; for the application of non-hermetic optical devices, especially the optical module is very small Optical modules such as SFP DD, QSFP DD and other packages, because the single rate reaches 100Gpbs and above, the corresponding PCBA is equipped with higher rate electrical chips, such as DSP chips, driver chips and other a...

AI Technical Summary

Problems solved by technology

In order to meet the electrical interface and optical interface stipulated in the agreement, when the PCBA in the optical module and the optical port of the optical device are hard-connected, since the PCBA and the optical device are completed in the normal production process, that is, the optical device component is made first, Then assembled into the module, the various deviations formed by the optical device components will accumulate at the module end, resulting in deviations in the key high-frequency electrical signals and key optical paths during hard connections, which in turn lead to large attenuation of the optical module signal, The insertion loss of the optical signal is large, and the module index is unqualified in severe cases. At the same time, the hard connection will cause the mechanical stress of the PCBA and the optical device after assembly, which will affect the reliability of the later stage.

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