Circuit board structure
A circuit board and heat dissipation structure technology, applied in the directions of printed circuits, printed circuits, circuit thermal devices, etc., can solve problems such as the reliability of circuit boards, and achieve the effect of good heat dissipation capacity
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[0055] Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used in the drawings and description to refer to the same or like parts.
[0056] Some embodiments are listed below and described in detail with the accompanying drawings, but the provided embodiments are not intended to limit the scope of the present invention. In addition, the drawings are for illustration purposes only and are not drawn to original scale. In order to facilitate understanding, the same elements in the following description will be described with the same symbols.
[0057] In addition, terms such as "first", "second", etc. used herein do not imply a sequence or order, and it should be understood that they are used to distinguish elements or operations described with the same technical terms.
[0058] Secondly, the words "comprising", "including...
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