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Modified filler and heat-conducting glue, and preparation methods and application thereof

A heat-conducting adhesive and modification technology, applied in the direction of adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve the problems of unrepresented adhesiveness, difficult to form glue, complicated production process, etc., and achieve improved permeability Compatibility, large-scale promotion, and simple production process

Active Publication Date: 2021-10-19
GUANGZHOU BAIYUN CHEM IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patented technology allows for improved thermal conduction by modifying certain materials that have been added onto polymers or rubbers during manufacturing processes such as injection moldings. These modifications improve their ability to transmit heat effectively without compromising its properties like strength. Additionally, these modification techniques allow for easier addition of other components on top of them while maintaining good bond between it and the material being reinforced. Overall, this innovation makes better ways to make products from synthetic resin laminated panels (SLCs).

Problems solved by technology

This patented technical problem addressed in this patents relates to improving the stability and reliability of multi functional thermal interfaces used for electronics devices while minimizing their impact on product lifespan caused by excess heat generated when they operate under heavy load conditions. Current methods involve either coating external surfaces with layers made of epoxy resin or filling gaps between them through polymers like polyimide. However, there are challenges associated with current techniques involving coating processes including complex steps, long dry time periods, large amounts of solvents needed, difficulty forming a strong glue upon adding agents, and lack of effective adherence onto certain types of plastic surface.

Method used

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  • Modified filler and heat-conducting glue, and preparation methods and application thereof
  • Modified filler and heat-conducting glue, and preparation methods and application thereof
  • Modified filler and heat-conducting glue, and preparation methods and application thereof

Examples

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preparation example Construction

[0053] In a specific example, the preparation method of the second silane coupling agent comprises the following steps:

[0054] Take the amino silane and heat it for the first time, then add the graft modification reactant to carry out the reflux addition reaction;

[0055] Wherein, the temperature of the first heating is 30°C-45°C; the time of the reflux addition reaction is 2h-5h;

[0056] The weight ratio of the amino silane to the graft modification reactant is 1:(0.85-0.98).

[0057] Understandably, in this application, the temperature for the first heating includes but is not limited to 30°C, 31°C, 32°C, 33°C, 34°C, 35°C, 40°C, and 45°C; the time for reflux reaction includes but is not limited to Limited to 2h, 3h, 4h, 5h.

[0058] Understandably, in this application, the weight ratio of amino silane to graft modification reactant includes but not limited to 1:0.85, 1:0.86, 1:0.87, 1:0.88, 1:0.89, 1:0.90, 1:0.91, 1:0.92, 1:0.93, 1:0.94, 1:0.95, 1:0.96, 1:0.97, 1:0.98...

Embodiment 1

[0102] This embodiment provides a thermally conductive adhesive, and its raw material formula is as follows in parts by weight:

[0103] Polysiloxane (trimethoxy-terminated polysiloxane): 11 parts, 1500cP (25°C);

[0104] Modified filler: 82 parts;

[0105] Plasticizer (simethicone): 3 parts, 100cP (25°C);

[0106] Crosslinking agent (vinyltrimethoxysilane): 0.5 part;

[0107] Crosslinking agent (methyltrimethoxysilane): 1.5 parts;

[0108] Catalyst (diisopropoxy bis(ethoxyacetoacetyl)titanium compound): 1.5 parts;

[0109] Compound tackifier (bis-[3-(trimethoxysilyl)-propyl]-amine and 2-(3,4-epoxycyclohexyl)ethyltriethoxysilane in weight ratio 1: 1 ratio preparation): 0.5 parts.

[0110] Wherein, the preparation steps of modified filler are as follows:

[0111] S1: Put 100 parts of alumina heat-conducting powder with an average median particle size of 5 μm in a stirrer, start stirring, heat up to 120° C. and treat it under normal pressure for 3 hours, and cool to room t...

Embodiment 2

[0118] This embodiment provides a thermally conductive adhesive, and its raw material formula is as follows in parts by weight:

[0119] Polysiloxane (trimethoxy-terminated polysiloxane): 11 parts, 1500cP (25°C);

[0120] Modified filler: 82 parts;

[0121] Plasticizer (simethicone): 3 parts, 100cP (25°C);

[0122] Crosslinking agent (vinyltrimethoxysilane): 0.5 part;

[0123] Crosslinking agent (methyltrimethoxysilane): 1.5 parts;

[0124] Catalyst (diisopropoxy bis(ethoxyacetoacetyl)titanium compound): 1.5 parts;

[0125] Compound tackifier (bis-[3-(trimethoxysilyl)-propyl]-amine and 2-(3,4-epoxycyclohexyl)ethyltriethoxysilane in weight ratio 1: 1 ratio preparation): 0.5 parts.

[0126] Wherein, the preparation steps of modified filler are as follows:

[0127] S1: Put 100 parts of alumina heat-conducting powder with an average median particle size of 5 μm in a stirrer, start stirring, heat up to 120° C. and treat it under normal pressure for 3 hours, and cool to room t...

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Abstract

The invention provides a modified filler. The modified filler is heat-conducting powder modified by a first silane coupling agent and a second silane coupling agent in sequence, wherein the second silane coupling agent is modified silane containing a cyclohexyl group and a carbamido group; and the modified silane takes 4-methylcyclohexyl isocyanate and/or cyclohexyl isocyanate as a grafting modification reactant. The modified filler has strong adhesion, has good permeability and compatibility with a plastic substrate, and can be directly mixed with polysiloxane, and the viscosity of a mixed heat-conducting system is low. In addition, the production process required by the modified filler is simple and convenient, and large-scale popularization can be realized.

Description

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Claims

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Application Information

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Owner GUANGZHOU BAIYUN CHEM IND
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