A rapid cooling device for circuit board after soldering

A rapid cooling and post-soldering technology, which is applied to welding equipment, auxiliary devices, printed circuit assembly of electrical components, etc., can solve the problems of no shell insulation device and inability to quickly cool circuit boards, etc., and achieve good heat dissipation effect and water cooling heat dissipation effect Visible, outstanding cooling effect

Active Publication Date: 2022-03-15
黄石永兴隆电子有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a rapid cooling device for circuit boards after welding, which solves the existing problems that there is no housing heat preservation device and that the circuit boards after welding cannot be rapidly cooled

Method used

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  • A rapid cooling device for circuit board after soldering
  • A rapid cooling device for circuit board after soldering
  • A rapid cooling device for circuit board after soldering

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Embodiment Construction

[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0033] In the description of the present invention, it should be understood that the terms "upper", "middle", "outer", "inner", "lower", "surrounding", etc. indicate orientation or positional relationship, and are only for the convenience of describing the present invention and simplified descriptions, rather than indicating or implying that the components or elements referred to must have a specific orientation, be constructed and operate in a specific orientation,...

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Abstract

The invention discloses a rapid cooling device for circuit boards after welding, and relates to the technical field of rapid cooling after circuit boards are welded. The invention includes a shell heat preservation device, a communication device, a fixed structure, an air-cooled heat dissipation device, a placement frame structure, a heat exchange device, a pressurized structure and a water adding structure, the upper surface of the cylindrical support is connected with the lower surface of the heat preservation box, and the lower surface of the dust shield It is connected with the upper surface of the heat preservation box, one side surface of the heat preservation box is provided with an installation notch, the central rod is connected with the installation notch, and the swivel ring is installed on the outer surface of the central rod. In the present invention, by setting the heat preservation box and the dust-shielding board, the heat preservation box can keep the internal low-temperature environment warm for a long time, so that the internal cooling effect can be sustainable, and the long-time cooling can completely cool the circuit board after welding, and the cooling effect is remarkable , and this kind of insulation box keeps the internal temperature low, efficiently uses energy, reduces energy consumption, and the dust shielding board can effectively prevent the upper dust from falling into the circuit board.

Description

technical field [0001] The invention belongs to the technical field of quick cooling after welding of circuit boards, in particular to a quick cooling device after welding of circuit boards. Background technique [0002] The circuit board makes the circuit miniaturized and intuitive, and plays an important role in mass production of fixed circuits and optimizing the layout of electrical appliances. Today's circuit boards have developed surface mount technology, that is, multiple electronic components, such as capacitors, resistors, inductors, and integrated Circuits, etc. can be adhered to the surface of the circuit board to electrically connect the circuit board, so that the area of ​​the circuit board can be fully utilized, and more electronic components can be assembled. The above-mentioned electronic components are usually adhered to the circuit board by soldering, but due to Porous solder will cause high temperature on the surface of the circuit board, and the circuit b...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/34B23K3/08
CPCH05K3/34B23K3/085
Inventor 张顺义竺安伟
Owner 黄石永兴隆电子有限公司
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