Rapid cooling device for circuit board after welding

A rapid cooling and post-soldering technology, which is applied in auxiliary devices, welding equipment, printed circuit assembly of electric components, etc., can solve the problems of no shell insulation device, unable to quickly cool circuit boards, etc., and achieve good heat dissipation effect and water cooling heat dissipation effect Visible, outstanding cooling effect

Active Publication Date: 2021-10-12
黄石永兴隆电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a rapid cooling device for circuit boards after welding, which solves the existing problems that there is no housing heat preservation device and that the circuit boards after welding cannot be rapidly cooled

Method used

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  • Rapid cooling device for circuit board after welding
  • Rapid cooling device for circuit board after welding
  • Rapid cooling device for circuit board after welding

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Embodiment Construction

[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0033] In the description of the present invention, it should be understood that the terms "upper", "middle", "outer", "inner", "lower", "surrounding", etc. indicate orientation or positional relationship, and are only for the convenience of describing the present invention and simplified descriptions, rather than indicating or implying that the components or elements referred to must have a specific orientation, be constructed and operate in a specific orientation,...

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Abstract

The invention discloses a rapid cooling device for a circuit board after welding, and relates to the technical field of rapid cooling after circuit board welding. The device comprises a shell heat preservation device, a communication device, a fixing structure, an air cooling heat dissipation device, a placement frame structure, a heat exchange device, a pressurization structure and a water adding structure. The upper surface of a cylindrical support is connected with the lower surface of a heat preservation box body, the lower surface of a dust shielding plate is connected with the upper surface of the heat preservation box body, and a mounting notch is formed in the surface of one side of the heat preservation box body; a pivot rod is connected with the mounting notch, and a rotating ring is mounted on the outer surface of the pivot rod. According to the present invention, by arranging the heat preservation box body and the dust shielding plate, the heat preservation box body can conduct long-time heat preservation on the internal low-temperature environment, so that the internal cooling effect is sustainable, a welded circuit board can be completely cooled through long-time cooling, and the cooling effect is remarkable; the internal temperature is low all the time through the heat preservation box body, so that the energy is efficiently utilized, and the energy consumption is reduced; the dust shielding plate can effectively prevent dust from falling into the circuit board.

Description

technical field [0001] The invention belongs to the technical field of quick cooling after welding of circuit boards, in particular to a quick cooling device after welding of circuit boards. Background technique [0002] The circuit board makes the circuit miniaturized and intuitive, and plays an important role in mass production of fixed circuits and optimizing the layout of electrical appliances. Today's circuit boards have developed surface mount technology, that is, multiple electronic components, such as capacitors, resistors, inductors, and integrated Circuits, etc. can be adhered to the surface of the circuit board to electrically connect the circuit board, so that the area of ​​the circuit board can be fully utilized, and more electronic components can be assembled. The above-mentioned electronic components are usually adhered to the circuit board by soldering, but due to Porous solder will cause high temperature on the surface of the circuit board, and the circuit b...

Claims

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Application Information

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IPC IPC(8): H05K3/34B23K3/08
CPCH05K3/34B23K3/085
Inventor 张顺义竺安伟
Owner 黄石永兴隆电子有限公司
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