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Conveying system for vacuum reflow soldering furnace

A transmission system and vacuum reflow technology, applied in welding equipment, electric heating devices, auxiliary devices, etc., can solve problems such as inconvenient use, difficulty in achieving synchronous width adjustment, inconvenient adjustment of transmission belt width, etc., to ensure stability and improve production efficiency effect

Pending Publication Date: 2021-10-12
上海朗仕电子设备有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since this three-stage split transmission is independent of each other, complex software cooperation is required to achieve precise cooperation with each other, and the reliability is poor.
At the same time, when producing different types of components and circuit boards, it is very inconvenient to adjust the bandwidth of the conveyor belt, and manual adjustments are required, especially between the conveyor belt inside the vacuum device and the conveyor belt of the reflow oven. Achieve synchronous width adjustment, inconvenient to use

Method used

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  • Conveying system for vacuum reflow soldering furnace
  • Conveying system for vacuum reflow soldering furnace
  • Conveying system for vacuum reflow soldering furnace

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Embodiment Construction

[0034]The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments. This embodiment is carried out on the premise of the technical solution of the present invention, and detailed implementation and specific operation process are given, but the protection scope of the present invention is not limited to the following embodiments.

[0035] Such as figure 1 As shown, this embodiment provides a conveying system for a vacuum reflow oven, including an in-furnace conveying device, a vacuum device 2 and a track width adjusting device. The conveying system is integrally arranged inside the vacuum reflow oven. The in-furnace transport device includes at least one in-furnace transport track 1. In this embodiment, two parallel in-furnace transport tracks 1 are used, and each in-furnace transport track 1 includes two parallel transport chains 101.

[0036] Such as Figure 2~4 As shown, the vacuum device 2 includes a housi...

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Abstract

The invention relates to a conveying system for a vacuum reflow soldering furnace. The system is characterized by comprising an in-furnace transmission device, a vacuum device and a track width adjusting device. The in-furnace transmission device comprises at least one in-furnace transmission track; the vacuum device comprises a shell, a vacuum transmission module, a front door connecting shaft, a rear door connecting shaft, a first connecting shaft, a second connecting shaft and a plurality of transition shafts, and the positions of the vacuum transmission track and the in-furnace transmission track are collinearly corresponding one by one; the track width adjusting device is connected with each conveying chain in the in-furnace conveying track and each vacuum conveying chain in the vacuum conveying track, and the distance between the two conveying chains in the in-furnace conveying track and the distance between the two vacuum conveying chains in the vacuum conveying track which are collinearly corresponding to the in-furnace conveying track are synchronously adjusted. Compared with the prior art, the in-furnace conveying track in the in-furnace conveying device and the vacuum conveying track in the vacuum conveying module achieve a synchronous width adjusting function.

Description

technical field [0001] The invention relates to a welding supporting equipment, in particular to a conveying system for a vacuum reflow oven. Background technique [0002] The reflow oven is a device that provides a heating environment to melt the solder paste by heating, so that the surface mount components and the circuit board are reliably bonded together through the solder paste alloy. Vacuum reflow oven is the key equipment of surface mount technology in electronics manufacturing industry. Its quality and operation directly affect the quality of the final product. Once the soldering process is completed, if you want to repair defective solder joints, components or circuit boards It will be very complicated and expensive. [0003] With the development of the electronics industry towards miniaturization and multi-specification, the requirements for product quality are getting higher and higher. In order to meet the new needs of the market and reduce product defects cause...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K3/08B23K3/04
CPCB23K3/08B23K3/04B23K2101/36B23K2101/42
Inventor 詹姆斯·内维尔大卫·海乐卢明严超张亮
Owner 上海朗仕电子设备有限公司
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