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Card holder and server

A card holder and board technology, applied in cooling/ventilation/heating transformation, electrical components, chassis/cabinet/drawer parts, etc., can solve problems such as air leakage, increase mold opening cost, and inability to dissipate heat

Active Publication Date: 2021-10-08
NANCHANG HUAQIN ELECTRONIC TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003]Because the size of the board is different, it is necessary to set different sizes of baffles, and there is no commonality between the baffles, so the number of parts is increased and the improvement mold opening cost
In addition, the operation and maintenance personnel need to remove or install the corresponding baffles according to the settings of the boards. During this process, there may be missing or wrong baffles, which will cause air leakage or failure to dissipate heat.

Method used

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  • Card holder and server
  • Card holder and server

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Embodiment Construction

[0022] The invention discloses a card seat, the baffle in the card seat has universality, and at the same time, the card seat can avoid the problems of air leakage or inability to dissipate heat. The invention also discloses a server.

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts fall within the protection scope of the present invention.

[0024] In the description of the present invention, the orientations or positional relationships indicated by the terms "upper", "lower" and the like are based on the orientations or positional relationships sho...

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Abstract

The invention discloses a card holder which comprises a card holder body and further comprises blocking pieces, the blocking pieces are arranged on the side, close to an air cooling assembly, of the card holder body, the blocking pieces are used for blocking cold air, the blocking pieces are elastic pieces, the blocking pieces are arranged side by side, after a board card is installed, the corresponding blocking pieces are shrunk under extrusion of the board card, and after pressure is relieved, the corresponding blocking piece can be reset. According to the invention, the sizes of all the blocking pieces are the same. The board cards of different sizes can extrude the blocking pieces of different numbers. The blocking piece has universality and is suitable for board cards of different sizes, so that development of parts is reduced, the mold opening cost is reduced, and meanwhile the production rate and the shipment rate are improved. The blocking pieces are not disassembled, after the board card is installed, the corresponding blocking pieces automatically contract to form the air channels, and after the board card is disassembled, the corresponding blocking pieces can automatically reset. The invention further discloses a server.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of servers, and more specifically, to a deck and a server. Background technique [0002] The server is provided with a board, a deck, a blank, and an air-cooling component. Air cooling components are used to provide cool air. Card holder for board installation. There are usually multiple boards arranged in the server, and boards of different sizes correspond to blanks of different sizes. When the board is not installed, install all the baffles on the card holder near the air-cooled components, so as to play the role of beauty and safety regulations. When a board needs to be installed, the baffle corresponding to the board is disassembled, so that cold air can pass through the board to dissipate heat from the board. At this time, the baffle cannot be removed from the position where no board is installed to prevent air leakage. [0003] Due to the different sizes of the boards, it is n...

Claims

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Application Information

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IPC IPC(8): H05K5/02H05K7/20
CPCH05K5/0213H05K5/0217H05K7/20136H05K7/20709H05K7/20718
Inventor 田颖曹凯
Owner NANCHANG HUAQIN ELECTRONIC TECH CO LTD
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