Heat dissipation assembly, display device and assembling method of display device

Abstract

The invention provides a heat dissipation assembly, a display device and an assembling method of the display device, and relates to the technical field of display. The heat dissipation assembly comprises a back plate base body and a heat dissipation module located on one side of the back plate base body, and the heat dissipation module comprises a frame and a heat conduction piece. The frame comprises a first sub-frame, a second sub-frame and an elastic connecting piece; the first sub-frame is fixedly connected with the back plate base body, the elastic connecting piece is connected with the first sub-frame and the second sub-frame, and the heat conduction piece is fixedly connected with the second sub-frame; the orthographic projection of the first sub-frame on the plane where the back plate base body is located surrounds the orthographic projection of the second sub-frame on the plane where the back plate base body is located; the heat dissipation assembly comprises a first state and a second state; in the first state, in the direction perpendicular to the plane where the back plate base body is located, the distance between the heat conduction piece and the back plate base body is H1, and H1 is larger than 0; and in the second state, the heat conduction piece is in contact with the back plate base body. The elastic heat dissipation assembly can be completely attached to the display panel, and damage to the display panel is avoided.

Description

technical field [0001] The present invention relates to the field of display technology, and more specifically, to a heat dissipation component, a display device and an assembly method of the display device. Background technique [0002] With the development of display technology, ultra-large and ultra-thin display screens are increasingly favored by consumers. Larger and larger display screens will generate a lot of heat during use; the demand for ultra-high-quality display screens is increasing, and the display quality, brightness, and heat dissipation requirements of high-performance chips for the display screen Also getting bigger and bigger. [0003] In the prior art, large-area display screens mostly use passive heat dissipation, that is, the display screen is fixed on the heat-dissipating shell by pasting or other methods. Since the display screen adopts modular lamination in the bonding process, if the large-area, monolithic heat dissipation The way of shell bondin...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, large-area display screens mostly use passive heat dissipation, that is, the display screen is fixed on the heat-dissipating shell by pasting or other methods. Since the display screen adopts modular lamination in the bonding process, if the large-area, monolithic heat dissipation The way of shell bonding requires high processing precision of the shell, which may easily cause the display screen to fail to fit completely with the heat dissipation shell, and the completely rigid connection will cause irreparable damage to the fragile display screen when external vibrations occur.

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