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Electronic component packaging body, electronic component packaging assembly and electronic equipment

A technology of electronic components and packaging components, which is applied in the direction of assembling printed circuits with electrical components, electrical components, printed circuits connected with non-printed electrical components, etc., which can solve the problem of broken solder joints, poor reliability, and affecting the reliability of packaged components and other issues to achieve the effect of improving reliability, ensuring reliability, and reducing the risk of welding failure

Pending Publication Date: 2021-09-21
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the contact array package is a surface mount package technology, the package component and the circuit board are soldered through surface contact, the reliability of welding is poor, and it is easy to cause breakage at the solder joint, which affects the reliability of the package component

Method used

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  • Electronic component packaging body, electronic component packaging assembly and electronic equipment
  • Electronic component packaging body, electronic component packaging assembly and electronic equipment
  • Electronic component packaging body, electronic component packaging assembly and electronic equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 2

[0117] The difference between the electronic component packaging assembly 100 in the second embodiment and the electronic component packaging assembly 100 in the first embodiment lies in the structure of the electronic component packaging body 10 . understandably, Figure 6a The electronic component package 10 in this application is the second embodiment. For example, the electronic component package 10 includes a substrate 110 , an electronic component 120 packaged inside the substrate 110 , and a first lead 11 electrically connected to the electronic component 120 . At least two adjacently disposed surfaces of the first pins 11 are exposed to the substrate 110 . Exemplarily, the first pin 11 includes a bottom surface 111 of the first pin 11 and a side surface 112 of the first pin 11 connected to the bottom surface 111 of the first pin 11 , and the bottom surface 111 of the first pin 11 faces the circuit board. 20 , and both the bottom surface 111 of the first lead 11 and t...

Embodiment 3

[0127] The difference between the electronic component packaging assembly 100 in the third embodiment and the electronic component packaging assembly 100 in the foregoing embodiments lies in the structure of the electronic component packaging body 10 . understandably, Figure 8 or Figure 9a The electronic component package 10 in this application is the third embodiment. The following mainly describes the differences between this embodiment and the previous embodiments, and most of the same contents of this embodiment and the previous embodiments will not be repeated. For example, the electronic component package 10 includes a substrate 110 , an electronic component 120 packaged inside the substrate 110 , and a first lead 11 electrically connected to the electronic component 120 . At least two adjacently disposed surfaces of the first pins 11 are exposed to the substrate 110 . Exemplarily, the first pin 11 includes a bottom surface 111 of the first pin 11 and a side surface...

Embodiment 4

[0134] The difference between the electronic component packaging assembly 100 in the fourth embodiment and the electronic component packaging assembly 100 in the foregoing embodiments lies in the structure of the electronic component packaging body 10 . understandably, Figure 10 or Figure 11a The electronic component package 10 in this application is the fourth embodiment. The following mainly describes the differences between this embodiment and the third embodiment, and most of the same contents of this embodiment and the third embodiment will not be repeated.

[0135] In this embodiment, the package body 15 is provided with a groove 150 . The components 18 are accommodated in the grooves 150 , and the components 18 are exposed relative to the package body 15 . Figure 10 or Figure 11a The number, shape or position of the middle components 18 are only examples, and are not limited in the present application. Exemplarily, the number of grooves 150 is multiple. A plur...

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PUM

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Abstract

The embodiment of the invention discloses an electronic component packaging body, an electronic component packaging assembly and electronic equipment. The electronic component packaging body comprises a substrate, an electronic component and a first pin, the substrate comprises a bottom surface, a top surface and a first side surface, the first side surface is connected between the bottom surface and the top surface, and the electronic component is packaged in the substrate; and the first pin is embedded in the substrate and penetrates from the bottom surface to the top surface, the first pin comprises a bottom surface and a side surface connected with the bottom surface, the bottom surface is exposed relative to the bottom surface, and at least partial structure of the side surface is exposed relative to the first side surface. The bottom surface and the side surface are used for being welded with welding flux. The reliability of welding between the electronic component packaging body and the circuit board is high.

Description

technical field [0001] The present application relates to the field of packaging technology, and in particular, to an electronic component package, an electronic component package assembly, and an electronic device. Background technique [0002] With the development of electronic products in the direction of multi-function and light weight, embedded chip packaging has become a research hotspot in the field of electronic component packaging technology. In the existing chip-embedded package substrate, a contact array package (land grid array, LGA) is generally used to realize the fixation between the package body and the circuit board. However, since the contact array packaging is a surface mount packaging technology, the packaging components and the circuit board are welded through surface contact, and the reliability of the welding is poor, and it is easy to cause cracks at the solder joints, which affects the reliability of the packaging components. SUMMARY OF THE INVENTI...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/18H05K3/34H01L23/49
CPCH05K1/181H05K3/341H01L23/49H01L23/5389H01L23/49805H01L23/645H01L2924/19107H01L2924/19043H01L2924/19041H01L2924/19105H01L2924/19042H01L2924/1815H01L2224/04105H01L2224/04026H01L2224/05551H01L2224/05557H01L24/20H01L2225/1094H01L2225/1035H01L2225/1058H01L2225/1064H01L2924/15153H01L2924/15162H01L25/105H01L24/45H05K3/34
Inventor 向志强
Owner HUAWEI TECH CO LTD
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