Heating and infrared anti-reflection type structural member, as well as machining method and application thereof

A technology of infrared antireflection and structural parts, applied in ohmic resistance heating parts, electric heating devices, electrical components, etc., can solve problems such as affecting the uniformity of resistance wire heating effect

Active Publication Date: 2021-09-14
无锡鑫巨宏智能科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

", however, the setting of the avoidance 331 in turn affects the uniformity of the heating effect of the resistance wire. At present, there is no solution that can satisfy the uniformity of the heating effect and the reliability of radar light wave propagation at the same time.

Method used

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  • Heating and infrared anti-reflection type structural member, as well as machining method and application thereof
  • Heating and infrared anti-reflection type structural member, as well as machining method and application thereof
  • Heating and infrared anti-reflection type structural member, as well as machining method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] Such as figure 1 with figure 2 As shown, the structural member includes a base material layer 1 , a functional layer 2 , an infrared anti-reflection layer 3 , a waterproof layer 4 and a hardened strengthening layer 8 .

[0053]The base material layer 1 is injection-molded with infrared light-transmitting plastic, and the inner surface of the base material layer 1 can be made into a mirror effect to improve the transmittance of light waves. The functional layer 2 covers the surface of the substrate layer 1, and is used to heat the structure and transmit infrared light. The functional layer 2 includes a light-transmitting layer and a heating element fixed on the surface of the light-transmitting layer. The heating element consists of a positive lead and The negative pin is connected to the power supply after leading out the light-transmitting layer.

[0054] Among them, the light-transmitting layer can choose ITO conductive film 5, and the ITO conductive film 5 is plat...

Embodiment 2

[0067] Such as image 3 with Figure 4 As shown, the structural member includes a base material layer 1 , a functional layer 2 , an infrared anti-reflection layer 3 , a waterproof layer 4 and a hardened strengthening layer 8 .

[0068] The base material layer 1 is injection-molded with light-transmitting plastic, and the inner surface of the base material layer 1 can be made into a mirror effect to improve the transmittance of light waves.

[0069] The functional layer 2 covers the outer surface of the substrate layer 1, and is used to heat the structural parts and transmit infrared light. The functional layer 2 includes a light-transmitting layer and a heating element fixed on the surface of the light-transmitting layer. The heating element is connected by the positive lead Connect the power supply after leading out the light-transmitting layer with the negative pin. The heating element is a resistance wire applied to the light transmissive layer.

[0070] The light-transm...

Embodiment 3

[0083] The difference between this structural member and Embodiment 1 lies in the structure of the functional layer.

[0084] Such as Figure 5 As shown, the light-transmitting layer of the present embodiment is an ITO conductive film 5; the heating element is a graphene film 11, and the sheet-shaped graphene film 11 is provided with an insulating line 12, and the graphene film 11 is divided into the second by the insulating line 12. A conductive region 13 and a second conductive region 14, the first conductive region 13 and the second conductive region 14 are respectively connected to the positive pole and the negative pole of the power supply. The insulated wire 12 has a straight hollow shape, which can be processed by laser engraving or etching, or the first conductive region 13 and the second conductive region 14 can be pasted on the light-transmitting layer with conductive glue at intervals.

[0085] Graphene film 11 has good electrical and thermal conductivity, and the ...

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Abstract

The invention provides a heating and infrared anti-reflection type structural member as well as a machining method thereof. The structural member comprises the following layers of: a base material layer; a functional layer which covers the surface of the base material layer, is used for heating the structural member and can transmit infrared light, comprises a light-transmitting layer and a heating element fixedly connected to the surface of the light-transmitting layer, wherein the heating element is connected with a power supply after being led out of the light-transmitting layer through an anode pin and a cathode pin; an infrared anti-reflection layer which covers the inner surface of the functional layer and is used for anti-reflection of the infrared light, wherein the infrared anti-reflection layer is an AR anti-reflection film; and a waterproof layer which is used for preventing water for the functional layer and covers the inner surface of the infrared anti-reflection layer. The base material layer and the waterproof layer have infrared light permeability. According to the radome, a conductive heating function, demisting, deicing and other functions can be achieved; and meanwhile, the radome can transmit specific infrared wavelength functionally, and ensures reliable operation of a radar.

Description

technical field [0001] The invention relates to a heating and infrared anti-reflection structural part, a processing method and an application thereof. Background technique [0002] With the rapid development of intelligent fields such as AI intelligence and autonomous driving, more requirements are placed on product functions and requirements. Take the laser radar products that need to be matched in this kind of smart field as an example. The laser radar cover is usually injection-molded, and the infrared transmittance of injection-molded plastics (such as PMMA and PC) is not high (about ≥85%). The requirements of actual application scenarios put forward the following functional requirements for plastic products: [0003] 1. The outer layer of the radome product must meet the reliability and mechanical strength of the ring test; [0004] 2. The radome needs to realize the function of conductive heating (requirements such as defogging and deicing); [0005] 3. The functio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05B3/00H05B3/02H05B3/04
CPCH05B3/00H05B3/02H05B3/04
Inventor 钱会明黄斌
Owner 无锡鑫巨宏智能科技有限公司
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