Preparation method of transformer packaging structure and packaging structure

Abstract

The invention provides a preparation method of a transformer packaging structure and the packaging structure, and belongs to the technical field of semiconductor device packaging, and the preparation method of the transformer packaging structure comprises the steps: providing a wafer; forming an iron core on the first surface of the wafer; and forming a primary coil and a secondary coil which are arranged in an insulating manner on the first surface of the wafer through a primary composition process, wherein the primary coil and the secondary coil are arranged on the same layer, the primary coil is wound on the primary side of the iron core, and the secondary coil is wound on the secondary side of the iron core. The primary coil and the secondary coil of the transformer are prepared in the same metal layer, so that the size of the transformer can be effectively reduced, the process is simplified, the cost is reduced, the turn ratio of the primary coil to the secondary coil can be effectively increased, and the transformation coefficient is increased.

Description

technical field [0001] The invention belongs to the technical field of semiconductor device packaging, and in particular relates to a method for preparing a transformer packaging structure and the packaging structure. Background technique [0002] The common on-chip transformer balun mainly uses a high-frequency transformer to achieve balanced and unbalanced conversion. The number of turns between the primary coil and the secondary coil is relatively small, and the transformation coefficient is low. In addition, the primary coil and the secondary coil are made of two layers of metal, which leads to larger size of the device, more complicated process and high process cost. [0003] In view of the above problems, it is necessary to propose a method for preparing a transformer packaging structure and a packaging structure with reasonable design and effectively solving the above problems. Contents of the invention [0004] The present invention aims to solve at least one of t...

AI Technical Summary

Problems solved by technology

[0002] The common on-chip transformer balun mainly realizes the balanced and unbalanced conversion through the high-frequency transformer. The number of turns between the primary coil and the secondary coil is relatively small, and the transformation coefficient is low.

In addition, the primary coil and the secondary coil are made of two layers of metal, which leads to a larger device size, more complicated process, and high process cost

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