Selective contact area buried solar cell and back contact structure thereof
A solar cell and back contact technology, applied in the field of solar cells, can solve the problems of high groove width control requirements, poor passivation effect, etc., to solve the problem of high groove width control requirements, loose width control requirements, and good internal back reflection effect of effect
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Embodiment 1
[0085] The first embodiment of the present invention provides a back contact structure of a solar cell. For the convenience of description, only the parts related to the embodiment of the present invention are shown. Refer to Figure 1-Figure 10 As shown, the back contact structure of the solar cell provided by the embodiment of the present invention includes:
[0086] Grooves arranged at intervals on the back side of the silicon substrate 10;
[0087] A first dielectric layer 20 disposed on the back side of the silicon substrate 10;
[0088] a first doped region 30 disposed on the first dielectric layer 20 and disposed in the groove;
[0089] a second doped region 40 disposed on the first dielectric layer 20 and outside the groove;
[0090] A second dielectric layer 50 disposed between the first doped region 30 and the second doped region 40, the second dielectric layer 50 is at least one layer and its refractive index decreases sequentially from the back of the silicon sub...
Embodiment 2
[0130] The second embodiment of the present invention provides a selective contact area buried solar cell. For the convenience of description, only the parts related to the embodiment of the present invention are shown. Refer to Figure 1-Figure 10 As shown, the selective contact area buried solar cell provided by the embodiment of the present invention includes:
[0131] silicon substrate 10;
[0132] The back contact structure described in the foregoing embodiments on the back side of the silicon substrate 10; and
[0133] The third dielectric layer 90 is disposed on the front surface of the silicon substrate 10 .
[0134] Further, in an embodiment of the present invention, the second dielectric layer 50 and the third dielectric layer 90 can be prepared by preparing the front and back sides of the silicon substrate 10 respectively through the same process, and at this time, the third dielectric layer 90 can be The structure is the same as that of the second dielectric laye...
Embodiment 3
[0141] The third embodiment of the present invention provides a method for fabricating a selective contact region buried solar cell. For the convenience of description, only the parts related to the embodiment of the present invention are shown. Refer to Figure 11 As shown, the selective contact region buried solar cell manufacturing method provided in the embodiment of the present invention is used to prepare the selective contact region buried solar cell as described in the foregoing embodiments. Specifically, the method includes:
[0142] Step S11, creating a plurality of grooves arranged at intervals on the back surface of the silicon substrate;
[0143] Wherein, before step S11, it should also include preprocessing the silicon substrate;
[0144] The above pretreatment includes cleaning the silicon substrate and removing the damaged layer. Specifically, including:
[0145] (1) RCA standard cleaning, remove particles and organic matter on the surface of the silicon subs...
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