Epoxy resin for flexible circuit board, preparation method and device of epoxy resin and computer equipment

Abstract

The invention discloses epoxy resin for a flexible circuit board, a preparation method and device of the epoxy resin and computer equipment. The method comprises the following steps of preparing the following components in parts by weight: 30-50 parts of a hydroxyl styrene / styrene copolymer, 20-30 parts of halogenated alcohol, 10-15 parts of amino silicon oil, 15-25 parts of a curing agent, 10-20 parts of alkali liquor and 5-10 parts of dielectric filler, uniformly mixing the hydroxyl styrene / styrene copolymer, the halogenated alcohol and the amino silicon oil, adding a catalyst, heating in a temperature range of 40-80 DEG C for etherification reaction to obtain a first reactant, uniformly stirring the alkaline solution and the dielectric filler, naturally oxidizing in the atmosphere to obtain a second reactant, uniformly mixing the first reactant and the second reactant, washing with water to remove salt, and adding a curing agent for curing to obtain the epoxy resin. In the way, the dielectric property of the epoxy resin can be improved.

Description

technical field [0001] The invention relates to the technical field of epoxy resin, in particular to an epoxy resin used in a flexible circuit board and a preparation method, device and computer equipment thereof. Background technique [0002] In recent years, ever-changing electronic products continue to develop in the direction of small size, light weight, and complex functions. Printed circuit board (PCB, Printed Circuit Board) is an indispensable main basic part of electronic products, providing the interconnection of electrical signals and the support of electronic components. Especially flexible circuit board (FPC, Flexible Printed Circuit, FPC), is one of the industries with the most vigorous development momentum. [0003] Among conventional materials used for flexible wiring boards, epoxy resins excellent in adhesive properties are widely used. Epoxy resin generally refers to molecules containing two or more epoxy groups, with aliphatic, alicyclic or aromatic organ...

AI Technical Summary

Problems solved by technology

[0004] However, the epoxy resin used in the existing flexible circuit boards generally has a high dielectric constant and dielectric loss tangent, and the high-frequency characteristics are not sufficient, resulting in the general dielectric properties of the epoxy resin.

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