A kind of preparation method of insulating cardboard

A technology for insulating cardboard and cardboard, applied in the direction of mechanical processing/deformation, etc., can solve the problems of easy existence of holes and water channels, long processing cycle and uneven thickness of insulating cardboard, so as to overcome product quality defects, improve production efficiency, and improve utilization. rate effect

Active Publication Date: 2022-04-26
WEIFANG HUISHENG INSULATION TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing processing method is to use veneers (cardboards with a thickness less than 10mm) and glue them together with an adhesive. The number of veneers is determined according to the thickness of the insulating cardboard. Before bonding the veneers, they need to be dried to remove excess water. It is necessary to cool down the veneers to meet the temperature requirements of the adhesive, then apply glue or pad adhesive paper between adjacent veneers, and finally apply pressure to bond to the required thickness to obtain insulating cardboard. The process of the whole process More cumbersome, long processing cycle
Moreover, due to the adhesive contained in this production process, holes and water channels are prone to exist in the insulating cardboard, the thickness is uneven, and the density is uneven, and the uniformity and consistency of its insulating performance cannot be guaranteed.
The adhesive in the production of laminated cardboard also affects the performance of the oil in the transformer, which directly affects the withstand voltage performance of the transformer. At the same time, because the polarity of the adhesive is much greater than that of pure insulating pulp, the polarization effect and interface The adhesive effect is the main reason for the loss of electrical strength of non-homogeneous insulating materials, especially in transformers with DC ±600 and AC above 1000kv, the adverse effects of adhesives are very serious

Method used

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  • A kind of preparation method of insulating cardboard
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Embodiment one: The manufacture method of prior art (containing binder) 50mm cardboard:

[0029] 1. Cutting of the finished veneer: Take 17 sheets of 3mm cardboard, and cut the cardboard according to the size of the required product.

[0030] 2. Pad spacer stays: place spacer stays between the cardboards, and place different numbers of stays between each adjacent cardboard. The number of stays is determined according to the size of the finished product, and the distance between the stays does not exceed 300mm.

[0031] 3. Cardboard drying: Put the cardboard with the stays into the hot air circulation drying oven, dry at 125°C, and the drying time is more than 36 hours, subject to the final cardboard moisture being less than 1%.

[0032] 4. Cardboard cooling: Run the dried cardboard to the glue coating area, and use a fan to cool down. The cooling time is about 2 hours.

[0033] 5. Glue application: Use a glue applicator to apply glue to the cardboard, and stack the c...

Embodiment 2

[0036] Embodiment two: 10mm cardboard production of the present invention:

[0037] 1. Take wet cardboard: Take the wet cardboard corresponding to the finished product 10mm in thickness of about 36mm, and the quantity is 1 piece.

[0038] 2. Wet cardboard humidification and stacking: add water to the surface of the wet cardboard until the water surface evenly covers the cardboard surface, and use plastic rollers to roll.

[0039] 3. Stand still: put the stacked cardboards for 6 hours to make the moisture of the wet cardboards more uniform.

[0040] 4. Mold on wet cardboard: Place the wet cardboard on the mold with stainless steel mesh.

[0041] 5. Wet cardboard pressing:

[0042] ① Pre-pressing: Start the pressing button, manual control, the initial set pressure is 1Mpa, gradually increase the pressure, a single increase of 0.2Mpa, with the continuous loss of moisture in the wet cardboard, the pressure will gradually decrease, until the pressure drops to the last set press...

Embodiment 3

[0045] Embodiment three: 15mm cardboard production:

[0046] 1. Take wet cardboard: take wet cardboard with a thickness of 27mm wet cardboard, and the quantity is 2 pieces.

[0047] 2. Wet cardboard humidification, stacking: Add water to the surface of the first cardboard until the water surface evenly covers the surface of the cardboard, and use a plastic roller to roll the surface of the second layer of cardboard in the same way as the first cardboard, and then Place the bottom surface of the second cardboard with the top surface of the first cardboard, edge-aligned and stacked.

[0048] 3. Stand still: put the stacked cardboards for 6 hours to make the moisture of the wet cardboards more uniform.

[0049] 4. Mold on wet cardboard: Place the wet cardboard on the mold with stainless steel mesh.

[0050] 5. Wet cardboard pressing:

[0051] ① Pre-pressing: Start the pressing button, manual control, the initial set pressure is 1Mpa, gradually increase the pressure, a single...

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Abstract

The invention discloses a preparation method of insulating cardboard. Firstly, the thickness and quantity of the single board are selected according to the thickness of the insulating cardboard, and then humidified, stacked, placed, and molded, and then the wet cardboard on the mold is cold-pressed and hot-pressed. Finally cut to shape. The invention can effectively remove the defects caused by the adhesive in the preparation of the insulating cardboard with a thickness of 10 mm to 50 mm, and improve the overall quality and production efficiency of the insulating cardboard.

Description

technical field [0001] The invention belongs to the technical field of insulating product production, and in particular relates to a preparation method of insulating cardboard. Background technique [0002] Laminated cardboard is a widely used material in transformer insulation parts. Generally speaking, insulating cardboard parts with a thickness of more than 10mm need to be processed with laminated cardboard. The existing processing method is to use veneers (cardboards with a thickness less than 10mm) and glue them together with an adhesive. The number of veneers is determined according to the thickness of the insulating cardboard. Before bonding the veneers, they need to be dried to remove excess water. It is necessary to cool down the veneers to meet the temperature requirements of the adhesive, then apply glue or pad adhesive paper between adjacent veneers, and finally apply pressure to bond to the required thickness to obtain insulating cardboard. The process of the wh...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B31F1/00
CPCB31F1/0035
Inventor 闫守贵张斌薛冬冬
Owner WEIFANG HUISHENG INSULATION TECH
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