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A kind of silicon carbide crystal and preparation method thereof

A technology of silicon carbide and crystal, which is applied in the field of silicon carbide crystal and its preparation, can solve the problems of crystal growth rate limitation, incapability of large-scale use, increasing crystal graphitization, etc., to reduce crystal defects, increase sublimation rate and Utilization rate, effect of reducing interference

Active Publication Date: 2022-07-12
SICC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Graphitization of silicon carbide raw materials is a common instability factor, which will increase the possibility of crystal graphitization and the formation of other defects, so that the crystal growth rate is largely limited
[0004] The current solution is to add additional solid silicon to the graphite crucible, which can compensate for the lack of silicon in the growth material and prevent the graphitization of the growth material to a certain extent, but this will lead to the formation of liquid silicon droplets and the formation of polymorphic structures. The second is to use tantalum crucibles to create an environment for adsorbing carbon, which can significantly inhibit the graphitization of growth raw materials, but the price of tantalum crucibles is too high to be used on a large scale

Method used

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  • A kind of silicon carbide crystal and preparation method thereof
  • A kind of silicon carbide crystal and preparation method thereof
  • A kind of silicon carbide crystal and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0093] refer to Figure 1-3 , the embodiment of the present application discloses a reactor assembly for crystal growth, the reactor assembly includes a reaction chamber, a crystal growth chamber 3 and a material removal mechanism; the reaction chamber includes a raw material chamber 1 and a waste chamber 2, and the crystal growth chamber 3 is communicated with the raw material chamber 1 through the gas phase transmission channel. The raw material gas generated by the sublimation of the raw material in the raw material chamber 1 is transmitted to the crystal growth chamber 3 through the gas phase transmission channel. Waste is transferred to waste chamber 2.

[0094] Specifically, the raw material chamber 1 and the waste chamber 2 are separate chambers. The separate raw material chamber 1 and the waste chamber 2 can be adjacent to each other, and can be in the form of sleeves. The waste chamber 2 can be set to be fixed or unchanged. The chamber set to move in the reaction cha...

Embodiment 2

[0124] refer to Figure 4 , the difference between this embodiment and Embodiment 1 is that the waste chamber 2 is sleeved on the periphery of the raw material chamber 1, and the waste chamber 2 is formed between the reaction chamber outer cylinder 11 and the reaction chamber inner cylinder 12, and the reaction chamber inner cylinder 12. 12 forms the raw material chamber 1 . In this setting, the top of the raw material chamber 1 is a high temperature area, the raw material is sublimated for crystal growth, and the material removal mechanism removes the waste material in the raw material chamber 1 in time, so that the waste material falls into the bottom of the waste material chamber 2. At this time, the waste material is far away from the high temperature area and cannot be Continue to be sublimated by heat to avoid crystal defects caused by waste materials and further improve the growth quality of crystals.

[0125] As an embodiment, the material receiving table 51 pushes th...

Embodiment 3

[0128] In the embodiment not shown, a raw material chamber 1 is formed between the outer cylinder 11 of the reaction chamber and the inner cylinder 12 of the reaction chamber, and the waste chamber 2 is arranged at the bottom, the top of the raw material chamber 1 or the outside of the outer cylinder 11 of the reaction chamber. The surface of the cylinder 12 has a higher porosity than the surface of the outer cylinder 11 of the reaction chamber. The seed crystal is arranged in the inner cylinder 12 of the reaction chamber in the form of a cylinder. The extension direction of the seed crystal and the central axis of the inner cylinder 12 of the reaction chamber is approximately the same. A crystal growth chamber 3 is formed between the crystal and the inner side wall of the inner cylinder 12 of the reaction chamber, and the heating device is arranged on the outside of the outer cylinder 11 of the reaction chamber, so that the raw material gas in the raw material chamber 1 passes ...

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Abstract

The application discloses a preparation method of silicon carbide crystal, which belongs to the field of semiconductor material preparation. The method includes: providing a reaction chamber, a crystal growing chamber and a material removing mechanism, the reaction chamber includes a raw material chamber and a waste chamber, and the silicon carbide raw material is loaded into the raw material chamber; The raw material gas generated by the sublimation of the raw material in the chamber is transmitted to the crystal growth chamber through the gas phase transmission channel for crystal growth. When the sublimation rate of the silicon carbide raw material is the first sublimation rate, the material removal mechanism is activated, and the material removal mechanism is used to remove the reaction chamber. The waste generated after the sublimation of the inner raw material is transferred to the waste chamber, and the remaining raw material in the raw material chamber continues to sublime for crystal growth under the crystal growth conditions. Silicon carbide crystals. The present application can improve the sublimation rate and utilization rate of raw materials, and reduce crystal defects.

Description

technical field [0001] The application relates to a silicon carbide crystal and a preparation method thereof, belonging to the field of semiconductor material preparation. Background technique [0002] At present, in the preparation of silicon carbide crystals, the physical vapor transport (referred to as PVT method) technology is mainly used. m C n Then, driven by the axial temperature gradient, it is transferred to the seed crystal to crystallize and grow into a silicon carbide crystal. PVT method is a complex process, and many parameters must be comprehensively controlled, such as growth temperature, temperature gradient, direct distance between seed crystal and growth material, gas pressure, etc. If any one parameter is not well controlled, the stability of crystal growth Sex will be destroyed. [0003] In the later stage of the growth of silicon carbide crystals, the non-stoichiometric decomposition of the silicon carbide raw material will occur, and more silicon ato...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C30B29/36C30B23/00
CPCC30B29/36C30B23/00
Inventor 刘鹏飞刘星刘家朋李加林
Owner SICC CO LTD
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