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Heat dissipation assembly and electronic equipment carrying same

A technology of heat dissipation components and flow channels, which is applied to structural components of electrical equipment, electrical components, cooling/ventilation/heating transformation, etc., can solve the problem of low efficiency of heat pipes in steam chambers, and achieve simple structure, simplified structure, and high-efficiency cooling Effect

Pending Publication Date: 2021-07-13
SHINE OPTOELECTRONICS KUNSHAN CO LTD
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  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

The steam cavity heat pipe utilizes liquid phase change, has good temperature uniformity and heat dissipation capacity, and has become the mainstream technology of passive heat dissipation at present. However, the efficiency of this type of steam cavity heat pipe is not high. How to improve the phase change efficiency of the phase change medium and the increasing It is more and more urgent to improve the heat dissipation efficiency in thinner electronic products

Method used

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  • Heat dissipation assembly and electronic equipment carrying same
  • Heat dissipation assembly and electronic equipment carrying same
  • Heat dissipation assembly and electronic equipment carrying same

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Embodiment Construction

[0049] In order to enable those skilled in the art to better understand the technical solutions proposed by the present invention, the technical solutions in the embodiments of this specification will be clearly and completely described below in conjunction with the drawings in the embodiments of this specification. Obviously, the described The embodiments are only some of the embodiments in this specification, not all of them. Based on one or more embodiments in this specification, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0050]The present application provides a heat dissipation assembly, which is used to provide high-efficiency cooling for electronic components with small area and high heat flux density, and does not need to configure a liquefied liquid working fluid return path to simplify the internal structure. The heat dissipation component solves the...

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Abstract

The invention provides a heat dissipation assembly and electronic equipment carrying the same, the heat dissipation assembly comprises: a first cover plate, wherein the first cover plate is provided with a first cavity, the bottom of the first cavity is provided with protrusions which are used for making contact with one side of a gas-liquid conversion module to form a steam cavity and are arranged at intervals, and the second cover plate is provided with a second cavity; and a gas-liquid conversion module, wherein the side, opposite to the side making contact with the protrusion, of the gas-liquid conversion module comprises a plurality of fins arranged at intervals, every two adjacent fins and the bottom, making contact with the fins, of the second cavity form a flow channel for storing the working medium, and the gas-liquid conversion module is provided with a plurality of through holes used for communicating the flow channel with the steam cavity. According to the heat dissipation assembly, heat of a heat source received by the second cover plate side is evenly transferred through phase change of the working medium, so that efficient heat transfer is achieved, and meanwhile the good temperature uniformizing performance is achieved.

Description

[0001] This application claims the priority of the Chinese patent application submitted to the China Patent Office on January 13, 2020, with the application number 202010033465.2, and the title of the invention is "A cooling component and electronic equipment equipped with it", the entire content of which is incorporated herein by reference. Applying. technical field [0002] The invention relates to the technical field of heat dissipation, in particular to a heat dissipation assembly for microelectronic elements and electronic equipment carrying it. Background technique [0003] With the rapid development of electronic information technology and popularization of applications, the development of electronic components presents a trend of high speed, high frequency and high integration. The temperature rises sharply. Excessively high temperature will reduce the stability and accuracy of electronic components, and at the same time will accelerate the aging of products and red...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/2029H05K7/20309H05K7/20336H05K7/20327
Inventor 方运方海刘伟
Owner SHINE OPTOELECTRONICS KUNSHAN CO LTD
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