Thin-film piezoelectric sensing element and its manufacturing method, sensing device and terminal

A technology of piezoelectric induction and components, applied in the manufacture/assembly of piezoelectric/electrostrictive devices, electrical components, piezoelectric/electrostrictive/magnetostrictive devices, etc., can solve the problem of increasing bonding failure rate, bonding Fixing failure, poor electrical performance, etc.

Active Publication Date: 2022-07-01
INTERFACE TECH CHENGDU CO LTD +3
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Please also refer to image 3 , so that two flexible circuit boards need to be bonded twice, which increases the bonding failure rate and leads to poor electrical properties, that is, there is a certain bonding failure problem

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  • Thin-film piezoelectric sensing element and its manufacturing method, sensing device and terminal
  • Thin-film piezoelectric sensing element and its manufacturing method, sensing device and terminal
  • Thin-film piezoelectric sensing element and its manufacturing method, sensing device and terminal

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Embodiment Construction

[0047] In order to make the above objects, features and advantages of the present application more clearly understood, the specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.

[0048] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it can be directly on the other component or there may also be an intervening component. When a component is considered to be "connected" to anoth...

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Abstract

The present application relates to a thin-film piezoelectric sensing element and a manufacturing method thereof, a sensing device and a terminal, the thin-film piezoelectric sensing element comprises two stacked piezoelectric structures and an adhesive layer between the two piezoelectric structures; the piezoelectric structure It is composed of two superimposed conductor layers and a piezoelectric thin film layer between the two conductor layers; each piezoelectric structure is provided with an inner connecting end, and the inner connecting end is arranged in the adhesive layer to make a conductor layer and A conductor layer of the other piezoelectric structure is in contact with each other; the inner connecting ends of the two piezoelectric structures are arranged in a phase separated manner in the adhesive layer. On the one hand, it only needs to use bonding twice, which reduces the number of bonding times and related processes, and improves the bonding efficiency; It reduces the failure rate of bonding to a certain extent, and further improves the efficiency of bonding; on the other hand, it is beneficial to avoid the problem of poor electrical properties caused by traditional processes, and to ensure the service life of the product.

Description

technical field [0001] The present application relates to the field of piezoelectric induction, and in particular, to a thin-film piezoelectric induction element, a manufacturing method thereof, a sensing device, and a terminal. Background technique [0002] Thin-film piezoelectric elements, also known as thin-film piezoelectric sensing components, are made of thin-film piezoelectric materials (PiezoelectricMaterial), conductive layers, flexible printed circuit boards (FPCs) and adhesives. The conductive layers on the front and back sides of the material provide a pressure difference to drive the piezoelectric film to vibrate and emit sound waves. Therefore, according to the matching of acoustic characteristics, the traditional technology requires two piezoelectric materials to be pasted through an adhesive layer (Adhesive Layer), and then The flexible circuit board is fixed on the conductive layer in a bonding method, and a thin-film piezoelectric sensing component is fabri...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L41/083H01L41/25H01L41/277
CPCH10N30/503H10N30/505H10N30/50H10N30/03H10N30/057
Inventor 叶颖隆张志鹏林信诚
Owner INTERFACE TECH CHENGDU CO LTD
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