Film piezoelectric sensing element, manufacturing method thereof, sensing device and terminal

A piezoelectric induction and manufacturing method technology, applied in the manufacture/assembly of piezoelectric/electrostrictive devices, electrical components, piezoelectric/electrostrictive/magnetostrictive devices, etc., can solve the problem of increasing the bonding failure rate, Bonding failure, poor electrical performance, etc.

Active Publication Date: 2021-07-02
INTERFACE TECH CHENGDU CO LTD +3
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Please also refer to image 3 , so that two flexible circuit boards need to be bonded twice, which increases the bonding failure rate and leads to poor electrical properties, that is, there is a certain bonding failure problem

Method used

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  • Film piezoelectric sensing element, manufacturing method thereof, sensing device and terminal
  • Film piezoelectric sensing element, manufacturing method thereof, sensing device and terminal
  • Film piezoelectric sensing element, manufacturing method thereof, sensing device and terminal

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Embodiment Construction

[0047] In order to make the above purpose, features and advantages of the present application more obvious and understandable, the specific implementation manners of the present application will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the application. However, the present application can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0048] It should be noted that when a component is referred to as being “fixed on” or “set on” another component, it may be directly on the other component or there may also be an intervening component. When a component is said to be "connected" to another compo...

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PUM

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Abstract

The invention relates to a thin film piezoelectric sensing element, a manufacturing method thereof, a sensing device and a terminal. The thin film piezoelectric sensing element comprises two stacked piezoelectric structures and a bonding layer located between the two piezoelectric structures. Each piezoelectric structure is composed of two stacked conductor layers and a piezoelectric film layer located between the two conductor layers. Each piezoelectric structure is provided with an internal connection end portion, and the internal connection end portion is arranged in the bonding layer so that one conductor layer can abut against one conductor layer of the other piezoelectric structure. The inner connecting end portions of the two piezoelectric structures are arranged in the bonding layer in a separated mode. On one hand, only two-time bonding is needed, the bonding frequency and related procedures are reduced, and the bonding efficiency is improved; on the other hand, connection to the interior of a layer structure formed by stacking is not needed, the bonding process is easy to realize, the bonding failure rate is greatly reduced, and the bonding efficiency is further improved; and on the other hand, the problem of poor electrical property easily caused by the traditional process is avoided, and the service life of the product is ensured.

Description

technical field [0001] The present application relates to the field of piezoelectric sensing, in particular to a thin-film piezoelectric sensing element, a manufacturing method thereof, a sensing device and a terminal. Background technique [0002] Thin-film piezoelectric elements, also known as thin-film piezoelectric sensing components, are made of thin-film piezoelectric materials (PiezoelectricMaterial), conductive layers, flexible printed circuit boards (Flexible Printed Circuit, FPC) and adhesives. The conductive layer on the front and back of the material provides a pressure difference to drive the piezoelectric film to vibrate and emit sound waves. Therefore, according to the matching of acoustic characteristics, the traditional technology requires two piezoelectric materials to be bonded through the adhesive layer (Adhesive Layer), and then The flexible circuit board is fixed on the conductive layer in a bonding manner, and a thin-film piezoelectric sensing componen...

Claims

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Application Information

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IPC IPC(8): H01L41/083H01L41/25H01L41/277
CPCH10N30/503H10N30/505H10N30/50H10N30/03H10N30/057
Inventor 叶颖隆张志鹏林信诚
Owner INTERFACE TECH CHENGDU CO LTD
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