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Copper microalloy, copper microalloy wire and preparation method thereof

A technology of micro-alloy and copper alloy, which is applied in the direction of metal/alloy conductor, cable/conductor manufacturing, conductor, etc., can solve the problems of poor electric thermal fatigue resistance, lower application reliability, potential difference corrosion, etc., and achieve improved heat resistance Poor fatigue resistance, improved tensile strength, and improved fatigue resistance

Active Publication Date: 2022-06-28
NICHE TECH KAISER SHANTOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the different materials of the inner and outer layers, this type of copper wire will have poor resistance to electrothermal fatigue due to the difference in thermal expansion; moreover, because of the different materials, it is more prone to potential difference corrosion in a corrosive environment, which greatly reduces application reliability.

Method used

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  • Copper microalloy, copper microalloy wire and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] The copper microalloy in this example contains by weight: palladium 0.7%, gold 0.5%, silver 0.3%, platinum 0.2%, phosphorus 0.05%, silicon 0.05%, and the balance is copper. In this copper microalloy, phosphorus is represented by copper phosphide (Cu 3 P 2 ) in the form of silicon as copper silicide (Cu 5 Si) exist in the form.

[0045] The preparation method of above-mentioned copper microalloy comprises the following steps:

[0046] (1) Equipped with the following raw materials: copper, palladium, gold, silver, platinum, phosphorous copper master alloy material (the equipped phosphorous copper master alloy material is a homogenized phosphorous copper master alloy material, containing 5wt.% phosphorus and 95wt .% copper) and copper-silicon master alloy material (the equipped copper-silicon master alloy material is a homogenized copper-silicon master alloy material, containing 2 wt.% silicon and 98 wt.% copper);

[0047] All raw materials generally contain the followin...

experiment example

[0075] Take commercially available palladium-plated copper wire (Comparative Example 1), the copper alloy wire prepared in Comparative Example 2, the first wire prepared in Comparative Example 3, and the copper microalloy wire prepared in Example 1, and test the fusing current, Electrical resistance, tensile strength (many tests were performed, and the numerical range was counted), sulfur resistance, thermal fatigue, sodium chloride immersion corrosion resistance, and electrification fatigue life. The diameter of each wire used above was all 18 μm.

[0076] Measurement methods:

[0077] The measurement of sulfur resistance is to place the object to be tested in sulfur vapor at 120°C and bake for 1 hour, and observe the color change of the line surface after baking. If it turns yellow or black, it means poor vulcanization resistance; if there is no obvious discoloration, it means excellent vulcanization resistance.

[0078] The measurement of thermal fatigue is to heat the ob...

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Abstract

A copper microalloy containing by weight: palladium 0.5-0.7%, gold 0.3-0.5%, silver 0.1-0.3%, platinum 0.05-0.2%, phosphorus 0.05-0.1%, silicon 0.05-0.1%, and the balance is copper. In the copper microalloy, phosphorus is copper phosphide (Cu 3 P 2 ) exists in the form of silicon as copper silicide (Cu 5 Si) exists in the form. The present invention also provides a copper micro-alloy wire, which is made by using the above-mentioned copper micro-alloy through drawing process. The present invention also provides a preparation method for the above-mentioned copper microalloy and copper microalloy wire. The copper micro-alloy wire of the invention has good electrical conductivity and high corrosion resistance (more corrosion resistance than pure copper wire), and excellent mechanical strength and electrical fatigue properties. The copper micro-alloy wire of the present invention has a tensile strength of 5-7gf and a fatigue life of more than 300 times.

Description

technical field [0001] The invention relates to alloy materials, in particular to a copper microalloy, a wire made of the copper microalloy (a wire that can be used for IC and LED packaging), and a preparation method of the above copper microalloy and copper microalloy wire. Background technique [0002] Copper wire is the main material for making wires because of its good conductivity and low cost, but because copper wire is easily oxidized and easily corroded, which affects its conductivity. In order to reduce the oxidation of the copper wire, a coating layer is currently coated on the outer surface of the copper wire to reduce the oxidation and corrosion rate of the copper wire. [0003] For example, Chinese Patent No. CN 103745963 B discloses a copper-based lead wire and a semiconductor package structure carrying the copper-based lead wire, which is a copper wire as a core material by electrolytic gold plating, electroless gold plating or evaporation method. The outer s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C9/00B21C1/00C22C1/03H01B1/02H01B13/00
CPCC22C9/00C22C1/03H01B1/026H01B13/00B21C1/00
Inventor 周博轩周振基洪飞义郭骅德于锋波彭政展
Owner NICHE TECH KAISER SHANTOU
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