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A multi-cutter monocrystalline silicon cutting machine

A multi-blade and cutting machine technology, applied in the direction of manufacturing tools, stone processing equipment, fine working devices, etc., can solve problems such as affecting cutting efficiency, and achieve the effect of meeting the needs of different lengths and improving cutting efficiency.

Active Publication Date: 2021-11-09
曲靖阳光新能源股份有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] Monocrystalline silicon is used as a semiconductor material and has been widely used in various fields. Monocrystalline silicon has become one of the emerging industries with rapid and stable development in the world. In order to improve the production efficiency of monocrystalline silicon, monocrystalline silicon cutting machines are particularly important. Traditional monocrystalline silicon The truncation of silicon is cut with a band saw, and one cut can only be cut into two sections, which affects the cutting efficiency

Method used

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  • A multi-cutter monocrystalline silicon cutting machine
  • A multi-cutter monocrystalline silicon cutting machine
  • A multi-cutter monocrystalline silicon cutting machine

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Embodiment Construction

[0065] The preferred embodiments of the present invention will be described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.

[0066] refer to Figure 1-Figure 10 , a multi-cutter monocrystalline silicon cutting machine, comprising: a frame 1, a control device is installed in the frame 1;

[0067] A multi-cutter cutting device 2, the multi-cutter cutting device 2 is installed on the frame 1 through a feeding device 3, the multi-cutter cutting device 2 is used for cutting single crystal silicon rods, the feeding The device 3 is used for the feed cutting of the multi-blade cutting device 2;

[0068] Adjusting device 4, described adjusting device 4 is installed on the described multi-cutter cutting device 2, and described adjusting device 4 is used for adjusting the blade pitch of multi-cutte...

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Abstract

The invention relates to a multi-cutter monocrystalline silicon cutting machine, comprising: a frame, a control device is installed in the frame; a multi-cutter cutting device, the multi-cutter cutting device is installed on the frame, The multi-cutter cutting device is used for cutting monocrystalline silicon rods; the feeding device is installed on the frame, the feeding device is connected with the multi-cutter cutting device, and the The feeding device is used for the feed cutting of the multi-cutter cutting device; the adjusting device, the adjusting device is installed on the multi-cutter cutting device, and the adjusting device is used to adjust the distance between the cutter heads of the multi-cutter cutting device, The adjusting device, the feeding device and the multi-cutter cutting device are all electrically connected with the control device. Through the design of the above structure, the multi-cutter head cutting device can cut the monocrystalline silicon rod into multiple sections at one time, which improves the cutting efficiency. Different lengths of silicon rods are required.

Description

technical field [0001] The invention relates to the technical field of monocrystalline silicon cutting, and more specifically, the invention relates to a multi-head monocrystalline silicon cutting machine. Background technique [0002] Monocrystalline silicon is used as a semiconductor material and has been widely used in various fields. Monocrystalline silicon has become one of the emerging industries with rapid and stable development in the world. In order to improve the production efficiency of monocrystalline silicon, monocrystalline silicon cutting machines are particularly important. Traditional monocrystalline silicon The truncation of silicon is cut by band sawing, and one cut can only be cut into two sections, which affects the cutting efficiency. [0003] Therefore, a multi-cutter single crystal silicon cutting machine is proposed to solve the above problems. Contents of the invention [0004] A series of concepts in simplified form are introduced in the Summary...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D5/00B28D5/04
CPCB28D5/0058B28D5/0076B28D5/045
Inventor 谭鑫陈立民赵亮潘皓姜君
Owner 曲靖阳光新能源股份有限公司
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