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Glue injection equipment special for electronic product production

An electronic product and glue injection technology, applied in the field of glue injection, can solve the problems of affecting the glue injection effect of electronic products, inconvenience of precise glue injection of multiple products, and insufficient mixing of glue liquid, etc., to achieve easy replacement, high glue injection efficiency, Improve the effect of glue injection

Inactive Publication Date: 2021-06-29
长兴锐宏电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing glue injection equipment has low glue injection efficiency, which is not convenient for precise glue injection for multiple products. At the same time, the glue in the glue injection pipe is generally not mixed uniformly, which affects the glue injection effect of electronic products.

Method used

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  • Glue injection equipment special for electronic product production
  • Glue injection equipment special for electronic product production
  • Glue injection equipment special for electronic product production

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Experimental program
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Embodiment Construction

[0015] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0016] The specific implementation manner of the present invention will be further described below in conjunction with the accompanying drawings. Wherein the same components are denoted by the same reference numerals.

[0017] It should be noted that the words "front", "rear", "left", "right", "upper" and "lower" used in the following description refer to the directions in the drawings, and the words "inner" and "outer ” refer to directions towards or away from the geometric center of a particular part, respectively.

[0018] In order to make the content of the present invention more clearly understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention.

[0019] combined with Figure 1-4 , a special glue injection eq...

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Abstract

The invention discloses glue injection equipment special for electronic product production. The equipment comprises a base, wherein two first vertical plates are oppositely arranged above the base, a transverse plate is connected between the two first vertical plates, two side plates are oppositely arranged at the front end of the transverse plate, a first lead screw is rotatably arranged between the two side plates, a first motor used for driving the first lead screw to rotate is arranged on the outer side of one side plate, a first moving base is in threaded connection with the first lead screw, a guide plate is arranged on the front side face of the transverse plate, the first moving base is in sliding connection with the guide plate, a mounting plate is arranged at the front end of the first moving base, a hydraulic cylinder is arranged on the mounting plate, a fixing plate is arranged at the bottom of a piston rod of the hydraulic cylinder, a glue injection pipe is fixed to the fixing plate, a glue injection head is arranged at the bottom of the glue injection pipe, and a feeding assembly is arranged on the base. Compared with the prior art, the glue injection equipment has the advantages of being high in glue injection efficiency and good in glue injection effect.

Description

technical field [0001] The invention relates to the technical field of glue injection, in particular to a special glue injection equipment for the production of electronic products. Background technique [0002] Environmental glue injection equipment is often used in the injection molding process of electrical accessories such as cable accessories, heat-shrinkable insulating tubes, rubber protective covers, and lightning arresters. The existing glue injection equipment has low glue injection efficiency, which is not convenient for precise glue injection operations for multiple products. At the same time, the glue in the glue injection pipe is generally not mixed uniformly, which affects the glue injection effect of electronic products. Contents of the invention [0003] The technical problem to be solved by the present invention is to overcome the above technical defects and provide a special glue injection equipment for the production of electronic products. [0004] In ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05C5/02
CPCB05C5/02B05C13/02B05C11/10B01F27/90
Inventor 陈甲龙
Owner 长兴锐宏电子有限公司
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