Method and device for updating cleaning configuration in semiconductor process equipment

A technology for process equipment and configuration update, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc. It can solve the problems of users manually setting cleaning configuration, so as to avoid the process of cleaning configuration and improve production efficiency.

Pending Publication Date: 2021-06-22
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the embodiments of the present invention is to provide a method and device for updating the cleaning configuration in semiconductor process equipment to solve the problem that the EAP system requires the user to manually set the cleaning configuration

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  • Method and device for updating cleaning configuration in semiconductor process equipment
  • Method and device for updating cleaning configuration in semiconductor process equipment
  • Method and device for updating cleaning configuration in semiconductor process equipment

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Embodiment Construction

[0070] In order to make the above objects, features and advantages of the embodiments of the present invention more comprehensible, the embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0071] In order to introduce the present invention more clearly, the operation principle of the EAP system in this embodiment is briefly introduced first. The EAP system is the 200 mm SEMI standard EAP system specified by the International Semiconductor Industry Association (Semiconductor Equipment and Materials International, SEMI), including the control terminal and semiconductor process equipment. The control terminal can be a computer, server or programmable logic controller (Programmable Logic Controller) , PLC), etc., semiconductor process equipment can include controllers such as computers or PLCs, and a certain number of process chambers. Each process chamber can be equipped ...

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PUM

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Abstract

The embodiment of the invention provides an updating method and device for cleaning configuration in semiconductor process equipment, and the method comprises the steps: receiving material box information sent by the semiconductor process equipment through a control end, determining a processing technology corresponding to a to-be-processed part in a material box and target cleaning configuration corresponding to the processing technology based on the material box information, querying the current cleaning configuration of a process chamber used for processing the to-be-processed workpiece in the semiconductor process equipment, judging whether the current cleaning configuration is matched with the target cleaning configuration or not: if not, sending a configuration updating instruction to the semiconductor process equipment, and updating the current cleaning configuration to the target cleaning configuration. In this way, the control end can directly update the cleaning configuration of the process chamber in the semiconductor process equipment, the process that a user manually sets the cleaning configuration is avoided, and therefore the production efficiency of chips can be improved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a method and device for updating cleaning configurations in semiconductor process equipment. Background technique [0002] With the continuous expansion of the chip scale and the complexity of the production process, the chip manufacturing technology based on the equipment automation system (Equipment Automation Program, EAP) is more and more widely used in the field of chip manufacturing. [0003] The EAP system includes a control terminal and semiconductor process equipment communicatively connected to the control terminal. The semiconductor process equipment includes a certain number of process chambers, and different process chambers correspond to different processing procedures in the processing process. [0004] In the process chamber included in the semiconductor process equipment, the chamber environment of part or all of the process chamber needs to be cleaned dur...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/6704
Inventor 庄璐
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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