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Conductive electrode, preparation method thereof and electronic equipment

A technology of conductive electrodes and external electrodes, applied in the direction of equipment for manufacturing conductive/semiconductive layers, cable/conductor manufacturing, conductive layers on insulating carriers, etc., can solve reliability requirements or operating space size limitations, delamination And interface cracking, unable to meet the requirements and other problems, to meet the electrical connection and reliability requirements, improve adhesion, enhance the effect of stability

Pending Publication Date: 2021-06-22
HONOR DEVICE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, traditional electrical connection schemes are limited by reliability requirements or operating space size, and cannot meet the requirements
[0004] At present, there are mainly two ways to connect the transparent conductive film to the external circuit: crimping and bonding. For example, through various special-shaped conductive films (ACF, Anisotropic Conductive Film), the electrical connection between the transparent conductive film and the PCB pad is realized; However, the environmental reliability of ACF is poor, and defects such as delamination and interface cracking are prone to occur in temperature cycles and high-temperature and high-humidity environments.

Method used

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  • Conductive electrode, preparation method thereof and electronic equipment
  • Conductive electrode, preparation method thereof and electronic equipment
  • Conductive electrode, preparation method thereof and electronic equipment

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Embodiment Construction

[0115] In order to better understand the technical solutions of the present application, the embodiments of the present application will be described in detail below in conjunction with the accompanying drawings.

[0116] It should be clear that the described embodiments are only some of the embodiments of the present application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.

[0117] It should be noted that the term "and / or" used in this article is only an association relationship describing associated objects, which means that there may be three kinds of relationships, for example, A and / or B, which can mean: A exists alone, and at the same time A and B, there are three cases of B alone.

[0118] Unless otherwise defined or stated, professional and scientific terms used herein have the same meanings...

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Abstract

The invention relates to the technical field of conductive electrodes and electronic equipment, in particular to a conductive electrode, a preparation method thereof and electronic equipment. The conductive electrode comprises a transparent conductive film arranged on a base material; an adhesive middle layer arranged on the transparent conductive film; a metal layer arranged on the adhesive middle layer, wherein the metal layer is mainly made of precious metal and used for being bonded with an external circuit. According to the invention, the bonding strength of the transparent conductive electrode and the external circuit can be improved, and the requirements of electrical connectivity and connection reliability can be met at the same time.

Description

technical field [0001] The present application relates to the technical field of conductive electrodes and electronic equipment, in particular to a conductive electrode, a preparation method thereof, and electronic equipment. Background technique [0002] In recent years, electronic devices such as mobile phones, tablet computers and other consumer electronic products have become an indispensable tool in people's daily life. Such electronic products not only carry people's traditional communication needs, but also accompany people's needs for entertainment, photography and payment. Therefore, the processing and manufacturing of mobile phone electronic products has the requirements of miniaturization (portable), high integration (reduced volume and thickness), high complexity (integration of various functional modules), high reliability (long-term work) and other requirements. . The projector, as an important module for mobile phone function innovation, will also be integrat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B5/14H01B13/00
CPCH01B5/14H01B13/0026H01L24/00C23C14/025C23C14/185C03C17/36C03C17/3644C03C17/3649C03C17/3671C03C2217/948
Inventor 尚攀举司晖尤锦松郑鸿武斌
Owner HONOR DEVICE CO LTD
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