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Ultrathin flexible vapor chamber and manufacturing method

A vapor chamber, flexible technology, applied in the field of ultra-thin flexible vapor chamber and its production, can solve the problems of unfavorable large-scale application of ultra-thin flexible electronic equipment, poor thermal conductivity, high price, etc., and achieve equilibrium evaporation limit and condensation limit. , The effect of reducing wrinkle height and low production cost

Active Publication Date: 2021-06-01
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this kind of vapor chamber that achieves flexibility through materials will inevitably face problems such as high price, low flexibility, and poor thermal conductivity, which is not conducive to the large-scale application of ultra-thin flexible electronic devices.

Method used

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  • Ultrathin flexible vapor chamber and manufacturing method
  • Ultrathin flexible vapor chamber and manufacturing method
  • Ultrathin flexible vapor chamber and manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] like Figure 1-Figure 5 As shown, an ultra-thin flexible vapor chamber with an overall thickness of 0.6mm, including an upper shell plate 1, an upper shell plate liquid-absorbing core 2, a flexible support plate 3, a lower shell plate liquid-absorbing core 4 and Lower shell plate 5. The material of the upper shell 1 and the lower shell 5 is red copper, on which are provided a pit structure 11 and a folded structure 12 integrally formed by stamping; the liquid-absorbing core 2 of the upper shell and the liquid-absorbing core 4 of the lower shell are The flexible porous material is sintered together with the upper and lower shell plates through a graphite mold, and is specifically located in the pit.

[0036] The lower surface of the upper shell plate has a pit structure and is provided with a first fold structure.

[0037] The upper surface of the lower shell plate is a pit structure, and a second corrugation structure is provided at a position corresponding to the fir...

Embodiment 2

[0055] The difference between this embodiment and Embodiment 1 lies in that the first corrugated structure and the second corrugated structure are respectively located in the middle of the upper and lower shell plates, and the shapes of the first corrugated structure and the second corrugated structure are both triangular.

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Abstract

The invention discloses an ultrathin flexible vapor chamber and a manufacturing method. The ultrathin flexible vapor chamber comprises an upper shell plate, an upper shell plate liquid absorption core, a flexible supporting plate, a lower shell plate liquid absorption core and a lower shell plate which are sequentially arranged in an attached mode, the upper shell plate is provided with a first fold structure, and the lower shell plate is provided with a second fold structure, the first fold structure corresponds to the second fold structure in position, the upper shell plate and the lower shell plate are both of a pit structure, the upper shell plate and the lower shell plate are attached to form a closed cavity, the flexible supporting plate is a fold plate, and holes are formed in the flexible supporting plate. The ultrathin flexible vapor chamber has the advantages of being thin in thickness, capable of being flexibly installed, high in heat dissipation capacity and the like, and is an ideal choice for heat dissipation of flexible and curved-surface electronic elements.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of microelectronic devices, in particular to an ultra-thin flexible vapor chamber and a manufacturing method. Background technique [0002] With the miniaturization, integration, and complex functions of electronic equipment, the heat dissipation requirements of electronic equipment are getting higher and higher. How to achieve high heat flux heat dissipation in a limited space has become one of the main bottlenecks restricting the development of microelectronic equipment. On the other hand, with the large-scale popularization and application of wearable devices and flexible display screens in recent years, realizing uniform temperature cooling of electronic devices under flexible conditions has become a research hotspot in the field of heat dissipation. [0003] Vapor plates dissipate heat through phase change, have the advantages of small size, low price, large uniform temperature and h...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/20
Inventor 潘敏强黄平南陈昭亮
Owner SOUTH CHINA UNIV OF TECH
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