Semiconductor wafer expander

Abstract

The invention discloses a semiconductor wafer expander, which structurally comprises a first air cylinder, racks, an upper disc, a supporting base, a fixed frame, a second air cylinder, a heater and a heating disc, wherein the four racks are welded to the fixed frame, a rectangular plate is welded to the upper ends of the racks, the first air cylinder is installed above the rectangular plate, the first air cylinder is mechanically connected with the upper disc, and the upper disc is vertically opposite to the heating disc and the supporting base. According to the invention, a position correcting device is matched with a heating disc, the position correcting device drives a position correcting disc to continuously move towards the center position of the heating disc through an arranged telescopic air cylinder, and a wafer deviating from the central position of the heating disc is adjusted to the middle position in the synchronous movement of the position correcting disc, so that a film is uniformly heated.

Description

technical field [0001] The invention relates to the field of semiconductor processing equipment, in particular to a semiconductor wafer crystal expander. Background technique [0002] The main processing methods of wafers are slice processing and batch processing, that is, one or more wafers are processed at the same time. Die expansion is an auxiliary process before die bonding. Nearly, there is no way to use an automatic die-bonding machine, so a method must be used to separate the wafers. The film on which the chip is attached is stretchable. Use a crystal expander to stretch the film, and then put a die-bonding ring on it. , This is crystal expansion. When expanding the crystal, tear off the film of the wafer to be expanded, put the chip side up on the heating disc, wait for the film to be heated, and the film will shrink when it is heated, and then press the upper disc down. Buckle the lock, press the lower disc ascending travel switch, raise the heating disc to the ex...

AI Technical Summary

Problems solved by technology

[0003] The object of the present invention is to provide a semiconductor wafer crystal expander to solve the problem of placing the wafer on the heating disc when the wafer to be expanded is placed on the heating disc. However, when placing the wafer, if it cannot Make sure that the place with the wafer is placed in the middle of the heating disc as much as possible, so that when the film is heated, it is easy to cause uneven heating of the film and technical problems that affect the efficiency of crystal expansion

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