A chip testing method in a wide temperature range working environment

Abstract

The invention discloses a method for testing a chip in a working environment with a wide temperature range, which belongs to the technical fields of precision testing and measurement, micro-electromechanical systems, IC chip testing and probe cards; The test method is to adjust the middle guide plate first, so that the probe is bent to one side under the action of the middle guide plate or the probe does not bend, and then the probe touches the pad or contact of the bare core, and then Under the temperature of the working environment, forcefully squeeze the probe and the bare core, so that the pads or contacts to be tested are all in contact with the probe, and finally write the test program to the bare core to complete the test; A key technology in the MEMS probe structure and test method for chip testing, which is conducive to ensuring effective contact between the bare core and the probe during the testing of large-size or multi-test point chips in an ultra-high temperature working environment, which in turn is beneficial Test the chip.

Description

technical field [0001] The invention discloses a chip testing method in a wide temperature range working environment and belongs to the technical fields of precision testing and measurement, micro-electromechanical systems, IC chip testing and probe cards. Background technique [0002] A probe card is a device used to test bare die. The performance of the chip is tested by touching the probe to the pad or contact of the bare core to form an electrical connection, and by writing a test program to the chip. [0003] A key technology to realize the test is that the probes must all touch the pads or contacts of the bare core, which puts forward very high requirements on whether the ends of all probes are on the same plane. In this application, the degree to which the probe ends are in the same plane is defined as probe flatness. For a probe card with a small size and a small number of probes, it is easier to control the flatness of the probes, but for a probe card with a large...

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Problems solved by technology

[0006] This kind of probe card with guide plate combination structure can realize the bare core test work under most working conditions, however, there are still some bare core test tasks that cannot be completed for the following reasons: In order to make the test real and effective, we need to ensure that the bare core The test environment is consistent with the working environment of the chip. Different chips have different working temperatures. Some chips work in a high temperature environment of about 100 degrees Celsius, while some chips work in an ultra-high temperature environment of 200 degrees Celsius.

For those chips that work in an ultra-high temperature environment, we also need to complete the test in the same temperature environment. Due to the limitation of the probe material, the probe will lose its elasticity in such an ultra-high temperature environment. If you insist on using structures such as intermediate guides or If the method is used to bend the probe, it will cause the probe to be plastically deformed and unable to rebound, not only cannot complete the test work of the bare core, but also will damage the probe card in severe cases

[0007] It can be seen that referring to the solution provided by the invention patent "Probe Device for Vertical Probe Card", although it can be applied to the testing work of most bare cores, it still cannot ensure large size or Effective contact between die and probe during multi-test point chip testing

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