Self-adaptive chip automatic testing method

Abstract

The invention provides a self-adaptive chip automatic testing method. The method comprises the following steps: acquiring a chip test instruction sent by a test base station through an SPI; triggering the chip to run a chip self-test program according to the chip test instruction to obtain a test result; and feeding the test result back to the test base station through the SPI. The method can relate to technologies of communication, artificial intelligence, chip testing and the like, and the method can perform FT comprehensive testing on the chip and improve the factory yield of the chip.

Description

technical field [0001] The embodiments of the present application relate to technical fields such as communication, artificial intelligence, and chip testing, and more specifically, relate to an adaptive automatic chip testing method. Background technique [0002] The production of chips needs to go through many testing stages. Wafer testing (Circuit Probing, CP) is required before chip packaging, and final testing (Final Test, FT) is required after chip packaging. At present, in order to improve the yield rate of chips, chips are packaged After completion, FT testing will be carried out to ensure the functionality and stability of the chip. [0003] Usually, the packaged chip needs to reserve special pins for FT testing, so as to facilitate the comprehensive FT testing of the chip. However, the pin may be accidentally touched by a technician, causing erroneous operation or even destroying devices in the chip. [0004] Therefore, how to conduct a comprehensive FT test on t...

AI Technical Summary

Problems solved by technology

[0005] Provides an adaptive chip automated testing method, which solves the problem of FT comprehensive testing of chips without destroying the device

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