Semiconductor chip cleaning and drying all-in-one machine

Abstract

The invention discloses a semiconductor chip cleaning and drying all-in-one machine which comprises a working plate table, a mounting frame and a cleaning mechanism. A cleaning pool and a drying pool are arranged on the upper surface of the working plate table from left to right, a support is slidably connected in a sliding groove formed at the rear side of the upper surface of the working plate table, a first lead screw is transversely and rotationally connected in the sliding groove and is in threaded connection with a threaded hole at the lower end of the support, and the left end of the first lead screw is fixedly connected with an output shaft of a first motor arranged on the left side face of the working plate table. The mounting frame is slidably connected to a middle opening of the support, a second motor is arranged in the middle of a transverse plate arranged at the upper end of the support, and a second lead screw is arranged at the lower end of an output shaft of the second motor. The semiconductor chip cleaning and drying all-in-one machine has the advantages that cleaning and drying functions are integrated, cleaning is more thorough and more efficient, fixing, taking and placing of chips are facilitated, drying efficiency is higher, and drying is more thorough.

Description

technical field [0001] The invention relates to the technical field of chip manufacturing, in particular to an integrated washing and drying machine for semiconductor chips. Background technique [0002] A semiconductor chip is a semiconductor device that is etched and wired on a semiconductor sheet to achieve a certain function. In order to meet the needs of mass production, the electrical properties of the semiconductor must be predictable and stable, so doping The purity of the substance and the quality of the semiconductor lattice structure must be strictly required. Therefore, semiconductor chips usually need to be cleaned during production. The commonly used cleaning is roughly divided into dry cleaning and wet cleaning. Dry cleaning refers to cleaning with high-pressure airflow. , ozone, laser, plasma, ultraviolet light and other methods to clean the surface of the workpiece. Wet cleaning refers to the use of liquid cleaning media to remove liquid pollutants and solid...

AI Technical Summary

Problems solved by technology

[0002] A semiconductor chip is a semiconductor device that is etched and wired on a semiconductor sheet to achieve a certain function. In order to meet the needs of mass production, the electrical properties of the semiconductor must be predictable and stable, so doping The purity of the substance and the quality of the semiconductor lattice structure must be strictly required. Therefore, semiconductor chips usually need to be cleaned during production. The commonly used cleaning is roughly divided into dry cleaning and wet cleaning. Dry cleaning refers to cleaning with high-pressure airflow. , ozone, laser, plasma, ultraviolet light and other methods to clean the surface of the workpiece. Wet cleaning refers to the use of liquid cleaning media to remove liquid pollutants and solid pollutants from the surface of the workpiece, so that the surface of the workpiece can reach a certain degree of cleanliness. Wet cleaning should dry the chip, but the most commonly used method is spray cleaning, which is not thorough enough and needs to be dried separately after cleaning, and the drying efficiency is low, and the drying is not thorough enough to cause production The efficiency is low, so we propose a semiconductor chip cleaning and drying machine

Images