Quick material taking and placing mechanism and automatic laminating all-in-one machine applying same

Abstract

The invention discloses a rapid material taking and placing mechanism which comprises a mounting frame, a lifting driving assembly and a turnover assembly. The lifting driving assembly is mounted on the mounting frame, the turnover assembly is mounted on the lifting driving assembly, the turnover assembly comprises a first driving part and a rotating plate, the rotating plate is mounted at the driving end of the first driving part, the first driving part is installed on the lifting driving assembly, and a plurality of suction cups are installed on the upper end face and the lower end face of the rotating plate and matched with material parts. The invention further discloses an automatic laminating all-in-one machine which comprises the rapid material taking and placing mechanism and further comprises a rack, a first feeding mechanism, a second feeding mechanism, a laminating mechanism and a rotary disc mechanism. By means of the rapid material taking and placing mechanism, automatic taking and placing of the material parts can be realized, and the rapid material taking and placing mechanism has the advantages that the production efficiency and precision are high, the product quality and yield are improved, and the large-batch production requirement is met. According to the automatic laminating all-in-one machine, the rapid material taking and placing mechanism is applied, automatic material feeding, taking and laminating work can be achieved, and the production efficiency is high.

Description

technical field [0001] The invention relates to the field of mechanical equipment, in particular to a quick pick-and-discharge mechanism and an automatic bonding machine using the same. Background technique [0002] 3C products have emerged along with the development of the electronics industry in recent years, mainly referring to computer, communication, and consumer electronics products. In this industry, the development of technology is changing with each passing day. , upgrades are frequent, and a large number of new products are launched almost every month, which has become a hot area of ​​product design. [0003] Many electronic products, CNC, stamping and other small products need to achieve full-scale inspection and other processes. In terms of final bonding, it is necessary to find ways to meet automation requirements based on product characteristics and other conditions. In this way, it is necessary to require that multiple products can be picked and placed simply...

AI Technical Summary

Problems solved by technology

In the existing manufacturing process, most of the materials are picked and placed manually. Manual operation has the following disadvantages: 1. High labor cost and low efficiency; 2. Manual lamination is affected by human factors, which is prone to errors and easy Defective products are produced, and the yield rate is low; 3. It cannot meet mass production

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