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A semiconductor device heat dissipation structure and its preparation method

A heat dissipation structure and semiconductor technology, applied in semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve problems such as large thermal resistance and poor heat dissipation

Active Publication Date: 2021-06-25
度亘核芯光电技术(苏州)有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to provide a semiconductor device heat dissipation structure and its preparation method to solve the technical problems in the prior art that the semiconductor device heat dissipation structure has a large thermal resistance and poor heat dissipation effect

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  • A semiconductor device heat dissipation structure and its preparation method
  • A semiconductor device heat dissipation structure and its preparation method
  • A semiconductor device heat dissipation structure and its preparation method

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Embodiment Construction

[0038] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations. Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without cre...

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Abstract

A heat dissipation structure of a semiconductor device and a preparation method thereof. The heat dissipation structure of a semiconductor device includes a composite casing and a heat pipe arranged in the composite casing. Integral structure, the transition material layer is formed by mutual diffusion of atoms in the heat-absorbing material layer and the heat-dissipating material layer, a device mounting part is provided on the surface of the composite shell on the side of the heat-absorbing material layer, and the bottom surface of the device mounting part is used for setting In the semiconductor device, a cavity for circulating cooling medium is formed in the heat dissipation material layer, the composite shell and the tube wall of the heat pipe are integrally structured, and the heat pipe is located on the side opposite to the bottom surface of the device mounting part and extends toward the cavity. The heat dissipation structure of the semiconductor device is an integrated structure, there is no contact interface with high thermal resistance, and various heat dissipation methods can quickly dissipate the heat generated by the semiconductor device without increasing the volume of the heat dissipation structure of the semiconductor device, which can meet the needs of miniaturized devices.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a heat dissipation structure of a semiconductor device and a preparation method thereof. Background technique [0002] With the further development of science and technology, semiconductor technology, information technology and other cutting-edge technology fields are developing towards high power, high integration and miniaturization, resulting in the continuous increase of the heat dissipated by the system, and the high power density semiconductor devices inside the system continue to challenge the limit of its cooling system. [0003] In the prior art, a simple air-cooled or liquid-cooled heat dissipation system is usually used to cool down semiconductor devices. The heat dissipation efficiency of this type of heat dissipation system is low, and the liquid-cooled heat dissipation system usually has multiple component structures. Different component structures There wil...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/427H01L23/46H01L23/373H01L21/48
CPCH01L21/4803H01L23/3735H01L23/427H01L23/46
Inventor 赵卫东惠利省李靖卢乐杨国文
Owner 度亘核芯光电技术(苏州)有限公司
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