X/Ku wave band broadband frequency conversion assembly based on TSV technology

A ku-band, technical technology, applied in the field of X/Ku-band broadband frequency conversion components, can solve the problems of difficult to guarantee the performance consistency of multiple components, inability to adapt to miniaturization, poor electromagnetic compatibility, etc., to reduce the processing of harmonics and image signals. The effect of high difficulty, good in-band flatness, and high sensitivity

Pending Publication Date: 2021-05-07
NO 8511 RES INST OF CASIC
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Problems solved by technology

[0003] In his dissertation "Research on Microwave Broadband Frequency Conversion Components", the author Zhu Chenwei used independently designed multiple MEMS filters and single-pole multi-throw switches to build a switch filter group. The design method is a planar filter. Each filter Both need to use partition walls and adopt micro-assembly assembly, which has the problems of large volume and difficulty in ensuring the consistency of multi-component performance, and cannot meet the existing miniaturization and high-performance requirements
[0004] In the article "2-18GHz ultra-broadband miniaturization down-conversion channel design" published by Li Zhen in the Microwave Journal, the ultra-broadband frequency conversion component was realized by using microwave multi-layer board design, which mainly uses 2.5D circuit design, and there are Poor electromagnetic compatibility, serious crosstalk, and low integration

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  • X/Ku wave band broadband frequency conversion assembly based on TSV technology
  • X/Ku wave band broadband frequency conversion assembly based on TSV technology

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Embodiment Construction

[0017] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0018] The present invention is mainly aimed at in-depth research on the miniaturized microwave broadband frequency conversion components of a certain vehicle-mounted electronic interference equipment, and realizes the miniaturization design of the X / Ku band broadband frequency conversion components based on semiconductor TSV technology and micro-assembly multi-chip integration technology, effectively reducing the microwave The size of the electronic reconnaissance and jammer of the sub-system realizes the miniaturization of the system, and the volume and weight have obvious advantages compared with the integration of components, which meets the actual engineering needs. The implementation of the present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.

[0019] combine figure 1 , an X / Ku broadband fre...

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Abstract

The invention discloses an X / Ku wave band broadband frequency conversion assembly based on a TSV technology. The working frequency band covers 6-18 GHz, the output frequency is 1.3-2.3 GHz, stray and harmonic suppression is smaller than or equal to -50 dBm, and the output dynamic state is 30 dB. The SIP design is realized by adopting a semiconductor-based TSV technology, and then a multi-chip micro-assembly technology is adopted, so that the integration level is improved and the size of the assembly is reduced under the condition that the performance is not reduced.

Description

technical field [0001] The invention belongs to the field of microwave communication, and in particular relates to an X / Ku band broadband frequency conversion component based on TSV technology. Background technique [0002] In recent years, military and aerospace electronic equipment has developed towards "light, thin, and short", and the demand for high-density, high-function, and high-speed circuit components is becoming more and more urgent. The X / Ku-band broadband frequency conversion component is the core part of the microwave receiving front end of a certain vehicle-mounted electronic interference equipment, and its miniaturization design is of great significance. With the continuous development of microwave integrated circuit technology and micro-assembly technology, the miniaturization design of microwave components has also made great progress, and is developing in the direction of broadband, small size, light weight, high performance, and miniaturization. [0003]...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03D7/16
CPCH03D7/16Y02D30/70
Inventor 尹震峰干书剑李剑平胡云刘娟王寰马乐娟
Owner NO 8511 RES INST OF CASIC
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