Swing mechanism capable of dividing silicon wafers into columns

Abstract

The invention relates to a swing mechanism capable of dividing silicon wafers into columns. The swing mechanism is arranged on the upstream of a silicon wafer basket and comprises a water injection base plate, a water spraying cover plate and a swing device, the water injection base plate is obliquely arranged, a water tank is arranged on the water injection base plate, a through water injection pipe is arranged on the water injection base plate, the water injection pipe is communicated with the water tank, and the water spraying cover plate covers the water injection base plate. Through water outlet pipes are arranged on the water spraying cover plate, and the multiple water outlet pipes are matched with the water tank in position; and the swing device is arranged on the outer side of the water spraying cover plate and comprises a beam, a swing air cylinder and a swing rod, the swing rod is arranged on the lower side of the beam, and the swing air cylinder is arranged on the upper surface of the beam and connected with the swing rod which is tightly attached to the water spraying cover plate. The swing mechanism has the beneficial effects that turning two-side wafer loading is achieved through swinging of the swing rod, continuous wafer loading can be achieved, and the time for waiting for an empty wafer basket to be in place when the wafer basket full of silicon wafers is taken away is shortened; and the wafer basket storage amount of the equipment is increased, and the manual frequent basket taking and basket loading operation time is shortened.

Description

technical field [0001] The invention belongs to the field of silicon wafer manufacturing equipment, in particular to a swing mechanism capable of separating silicon wafers. Background technique [0002] In the existing technology, it is necessary to replace a new basket to continue loading after a basket is filled during loading. The empty baskets are arranged in sequence. Due to the limited position of the basket lifting mechanism, the number of baskets that can be accommodated is limited. , it is necessary to replace the film basket frequently, which will easily affect the film loading efficiency. Contents of the invention [0003] The problem to be solved by the present invention is to provide a swing mechanism capable of separating silicon wafers. [0004] In order to solve the above-mentioned technical problems, the technical solution adopted by the present invention is: a swing mechanism for separating silicon wafers, which is arranged upstream of the wafer basket, ...

AI Technical Summary

Problems solved by technology

[0002] In the existing technology, it is necessary to replace a new basket to continue loading after the basket is filled with film. The empty baskets are arranged in sequence. Due to the limited position of the basket lifting mechanism, the number of baskets that can be accommodated is limited. , it is necessary to replace the film basket frequently, which will easily affect the film loading efficiency

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