Semiconductor bump defect detection method, electronic equipment and storage medium

Abstract

The invention relates to a semiconductor bump defect detection method. The method comprises the steps of scanning a wafer by a spectral confocal displacement sensor, wherein the wafer comprises N semiconductor bumps, a first 3D point cloud picture is obtained, and N is an integer larger than 1; performing point cloud filtering on the first 3D point cloud image to obtain a second 3D point cloud image; converting the second 3D point cloud image into a to-be-measured 2D depth image, wherein pixel values of pixel points in the to-be-measured 2D depth image correspondingly represent depth information of the pixel points; extracting the to-be-measured 2D depth map to obtain a target detection image of the to-be-measured semiconductor bump; and acquiring structural parameters of the to-be-measured semiconductor bump according to the target detection image, comparing the structural parameters with a standard structural parameter range, and if the structural parameters are not matched with the standard structural parameter range, judging that the to-be-measured semiconductor bump has defects. According to the scheme provided by the invention, the defects of the semiconductor bump can be effectively detected, the detection accuracy is improved, and the quality of the semiconductor bump process is improved.

Description

technical field [0001] The present application relates to the technical field of defect detection, and in particular, to a semiconductor bump defect detection method, an electronic device and a storage medium. Background technique [0002] The current method for semiconductor bump defect detection is mainly based on laser line scan imaging. Laser line scan imaging is to project a laser line beam on the surface of the object to be tested through a laser transmitter, receive the reflected laser light through a photodetector, and then use a triangular The measurement method reconstructs the topography of the surface of the object to be measured, but in the above detection technology, some laser reflected beams cannot reach the imaging component due to the blocking of the concave corners of the surface of the object to be measured, resulting in partial positions on the surface of the object to be measured cannot be imaged , the detection accuracy will be affected by this, and ...

AI Technical Summary

Problems solved by technology

[0005] Only the spectral confocal 3D imaging method is used to measure the distance, but there is no method suitable for the detection of semiconductor bump defects. Therefore, it is necessary to develop a method based on the 3D point cloud data obtained by the spectral confocal 3D imaging method to detect semiconductor bump defects. detection method

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