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Premixing method of conductive glue, conductive adhesive tape and preparation method thereof

A conductive and glue technology, applied in the direction of conductive adhesives, adhesives, adhesive types, etc., can solve the problems of affecting the specific gravity of conductive particles, fast precipitation, solvent splashing, etc., to improve the wetting speed and stabilize the stirring process. , the effect of increasing the humidity

Pending Publication Date: 2021-04-20
DWELL PHOTOELECTRIC MATERIAL SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although this method can theoretically make the conductive particles wet in the solvent first, and then add them to the glue to disperse evenly, but due to the high density of the conductive particles and the extremely low viscosity of the solvent itself, the conductive particles are subject to little resistance and the precipitation speed Fast, so the conductive particles must be added to the glue quickly, which will cause the solvent to splash out, affect the specific gravity of the conductive particles, and ultimately affect the resistance of the product
In addition, when conductive particles need to be added multiple times in batches, the conductive particles added first are easy to precipitate, which affects the dispersion effect and work efficiency

Method used

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  • Premixing method of conductive glue, conductive adhesive tape and preparation method thereof
  • Premixing method of conductive glue, conductive adhesive tape and preparation method thereof
  • Premixing method of conductive glue, conductive adhesive tape and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] Weigh 5% of the total weight of the polyurethane glue BC-01 required for this production, add it to toluene and disperse it with a mixer until it is uniform to obtain the mixture A;

[0039] Weigh the required conductive particles, the specific conductive particles are nickel powder, the particle diameter is 10±5μm, add to the mixture A in batches, continue to stir until uniform to obtain the mixture B;

[0040] Slowly add mixture B to the remaining 95% glue and continue to stir until the conductive glue is evenly formed. The conductive glue can form the final conductive glue after adding other required components, and then it can be coated on the machine for production.

Embodiment 2

[0042] Weigh 5% of the total weight of acrylic glue BB-01 required for this production, add it to toluene and disperse it with a mixer until it is uniform to obtain a mixture A;

[0043] Weigh the required conductive particles, the specific conductive particles are nickel powder, the particle diameter is 40±5μm, add to the mixture A in batches, continue to stir until uniform to obtain the mixture B;

[0044] Slowly add mixture B to the remaining 95% glue and continue to stir until the conductive glue is evenly formed. The conductive glue can form the final conductive glue after adding other required components, and then it can be coated on the machine for production.

Embodiment 3

[0046] Weigh 15% of the total weight of the acrylic glue BB-02 required for this production, add it to toluene and disperse it with a mixer until it is uniform to obtain a mixture A;

[0047] Weigh the required conductive particles, the specific conductive particles are nickel powder, the particle diameter is 10±5μm, add to the mixture A in batches, continue to stir until uniform to obtain the mixture B;

[0048]Slowly add mixture B to the remaining 85% glue and continue to stir until the conductive glue is evenly formed. The conductive glue can form the final conductive glue after adding other required components, and then it can be coated on the machine for production.

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Abstract

The invention discloses a premixing method of conductive glue. The premixing method comprises the following steps: dispersing first glue with a first preset weight into a solvent, and performing uniform stirring to form a mixed solution A; adding conductive particles into the mixed solution A, and uniformly stirring to form a mixed solution B; and adding the mixed solution B into second glue with a second preset weight to be evenly stirred to form final conductive glue, wherein the second glue and the first glue are the same or different in component. The invention further discloses a preparation method of the conductive adhesive tape adopting the premixing method and the conductive adhesive tape. According to the premixing method, particle clusters formed by coating the conductive particles with glue can be reduced, so that the conductive particles are uniformly dispersed.

Description

technical field [0001] The invention relates to the field of adhesive tapes, in particular to a premixing method of conductive glue, a preparation method of the conductive adhesive tape and the conductive adhesive tape. Background technique [0002] When producing functional tapes, specific substances need to be added to achieve functional effects. For example, in order to meet the low resistance or reasonable resistance of the conductive tape, it is necessary to introduce conductive particles into the glue. However, the introduction of conductive particles into the glue is prone to agglomeration or uneven dispersion of conductive particles (such as attached figure 1 and 2 Shown), affect product performance and appearance requirements. [0003] There are two existing mixing methods. The first one is to add conductive particles to the glue once or more times, and then carry out the coating operation after stirring for a certain period of time. If the conductive particles ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/04C09J133/12C09J9/02C08J3/21
Inventor 任金刚杨慧达袁勇
Owner DWELL PHOTOELECTRIC MATERIAL SUZHOU
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