Chip packaging structure and packaging method

Abstract

The embodiment of the invention provides a chip packaging structure and packaging method. The structure comprises a substrate which is provided with a first connection part and a second connection part, wherein the first connection part and the second connection part are electrically connected through an internal circuit of the substrate, the second connection part is a through hole penetrating through the substrate, and an electroplated layer with a connecting hole is arranged in the through hole; a chip arranged on the substrate and electrically connected with the first connection part, so that a signal path is formed between the second connection part and the chip through the internal circuit of the substrate; a protective layer which is arranged on the substrate and wraps the chip and the second connection part, wherein a wire passing hole is formed in the position, corresponding to the second connection part, of the protective layer so that the signal wire can penetrate through the wire passing hole to be electrically connected with the second connection part. According to the technical scheme provided by the embodiment of the invention, the parasitic capacitance on the signal path can be reduced, the signal quality of a receiving end is effectively improved, the signal line connection reliability is improved, the size is reduced, and the cost is reduced.

Description

technical field [0001] The embodiments of the present invention relate to the technical field of packaging, and in particular to a chip packaging structure and a packaging method. Background technique [0002] At present, in terms of gimbal product form, due to the mechanical structure of the gimbal, the electronic equipment at the end of the gimbal load and the core motherboard of the fuselage need to be connected through multiple soft signal lines. Compared with FPC (Flexible Printed Circuit, flexible circuit board), the soft signal line has better characteristic impedance continuity and less high-frequency component loss. It is a better way to connect the gimbal side under the condition of insensitive cost. [0003] However, the existing pan / tilt products connected by soft signal lines also have certain defects when in use. For example, when the signal line propagates the signal, sometimes it will cause a certain degree of distortion to key indicators such as the amplitud...

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Problems solved by technology

[0003] However, the existing pan / tilt products connected by soft signal lines also have certain defects when in use. For example, when the signal line propagates the signal, sometimes it will cause a certain degree of distortion to key indicators such as the amplitude of the signal, the upper and lower edges, etc. Influence, making the SI (signal integrity) performance of the signal poor, resulting in poor signal quality received by the electronic equipment at the end of the gimbal load

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