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A wafer position detection device

A detection device and wafer technology, which is applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc., can solve problems such as the limitation of the applicable range of sensors, affecting the yield rate, and sensor defects, so as to reduce the area of ​​scratches and improve the quality of finished products. rate and improve reliability

Active Publication Date: 2021-07-02
HANGZHOU ZHONGGUI ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of this, the object of the present invention is to provide a wafer position detection device to solve the problem that the indirect detection sensor is easy to produce defects on the wafer surface, which affects the yield, and the direct detection sensor has limited application range.

Method used

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  • A wafer position detection device
  • A wafer position detection device
  • A wafer position detection device

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Embodiment Construction

[0039] The embodiment of the present invention discloses a wafer position detection device, so as to solve the problem that the wafer surface is defective due to the direct contact of the sensor and affects the yield.

[0040] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0041] see Figure 1-Figure 7 , figure 1 A schematic diagram of the appearance structure of the wafer position detection device provided by the embodiment of the present invention; figure 2 for figure 1 Schematic d...

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Abstract

The invention discloses a wafer position detection device, which comprises a mounting seat, a trigger assembly and a fluid pressure detection assembly; the trigger assembly arranged on the mounting seat includes a top cover protruding from the surface of the mounting seat to support the wafer, and The fluid delivery pipeline in the hollow cavity formed by the inner wall of the top cover, when the top cover is provided with a wafer, the top cover can move in a direction close to the fluid delivery pipeline to block the fluid delivery port of the fluid delivery pipeline; When no wafer is set on the top cover, under the action of fluid pressure, the top cover can move away from the fluid delivery port of the fluid delivery pipeline in a direction away from the fluid delivery pipeline; Contact, indirect detection of the wafer in place, to prevent defects on the wafer surface due to direct contact, which affects the yield; compared with optical sensors, it can realize the in place detection of wafers that are sensitive to light, and its scope of application wide, improve device versatility.

Description

technical field [0001] The present invention relates to the field of semiconductor processing equipment, and more particularly, to a wafer position detection device. Background technique [0002] In recent years, with the rapid development of the semiconductor industry, the manufacturing process line width of semiconductor chips has been reduced from 0.18um to less than 10nm, and the number of metal layers has increased from 5-6 layers to more layers. The copper process multi-layer wiring solves the problem of aluminum interconnection The bottleneck problem of the process also puts forward higher requirements for the global flattening. CMP is currently the best global planarization technology and an essential process link in the copper interconnect process. Copper (Cu) CMP process is prone to corrosion defects in addition to butterfly, erosion, and scratches. [0003] Various parts of CMP planarization equipment require real-time detection of wafer position. For example, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/67265H01L21/67253H01L21/67017
Inventor 徐枭宇
Owner HANGZHOU ZHONGGUI ELECTRONICS TECH CO LTD
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