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Transfer method and transfer device for micro light-emitting diode

A technology of light-emitting diodes and transfer methods, which is applied to semiconductor devices, electrical components, circuits, etc., can solve the problems of low preparation efficiency and long preparation cycle of Micro-LED display products, shorten the preparation cycle, improve material utilization, and improve Effect of grain number

Active Publication Date: 2021-03-30
FUZHOU BOE OPTOELECTRONICS TECH CO LTD +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In view of the shortcomings of the existing methods, this application proposes a transfer method and transfer device for micro-LEDs to solve the technical problems in the prior art that the preparation efficiency of Micro-LED display products is low or the preparation cycle is long

Method used

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  • Transfer method and transfer device for micro light-emitting diode
  • Transfer method and transfer device for micro light-emitting diode
  • Transfer method and transfer device for micro light-emitting diode

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Embodiment Construction

[0037] The present application is described in detail below, and examples of embodiments of the present application are shown in the drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. Also, detailed descriptions of known technologies will be omitted if they are not necessary to illustrate the features of the present application. The embodiments described below by referring to the figures are exemplary only for explaining the present application, and are not construed as limiting the present application.

[0038] Those skilled in the art can understand that, unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meanings as commonly understood by those of ordinary skill in the art to which this application belongs. It should also be understood that terms, such as those defined in commonly used dictionaries, should be ...

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Abstract

The embodiment of the invention provides a transfer method and a transfer device of a micro light emitting diode. The transfer method comprises the following steps of manufacturing an expandable material unit at one side of at least one micro light-emitting diode grain on at least one substrate base material to obtain at least one micro light-emitting diode transfer body; exciting the expandable material unit in at least part of the micro light-emitting diode transfer body to expand; adsorbing at least part of the micro light-emitting diode transfer body on the substrate base material to a transfer substrate; releasing at least part of the micro light-emitting diode transfer bodies located on the transfer substrate to a target substrate; and removing each expandable material unit in the light emitting diode transfer body of the target substrate. According to the embodiment of the invention, the spacing of the micro light-emitting diode grains in the transfer process is adjustable, so that the preparation efficiency of the micro light-emitting diode can be improved, and the preparation period is shortened.

Description

technical field [0001] The present application relates to the field of display technology, and in particular, the present application relates to a transfer method and transfer device for micro light emitting diodes. Background technique [0002] Micro-LED (miniature light-emitting diode) technology is a new generation of display technology. Due to lattice matching, Micro-LED grains must first be grown on a sapphire-like substrate, and then the Micro-LED grains will be transferred onto the glass substrate (target substrate) of the display product. However, the glass substrate of the display is much larger than the sapphire substrate, so in the process of Micro-LED display products, it needs to undergo quite a few Micro-LED grain transfers, which will lead to low production efficiency and long production cycle and other defects. Contents of the invention [0003] In view of the shortcomings of the existing methods, the present application proposes a transfer method and tra...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/683H01L25/075
CPCH01L21/67144H01L21/6838H01L21/6835H01L25/0753H01L2221/68368
Inventor 杨姗姗陈曦冯玉春胡龙敢柳奇杨小宝黄张翔翟艳丽孙茉莉
Owner FUZHOU BOE OPTOELECTRONICS TECH CO LTD
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