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Wafer cleaning device

A technology for cleaning devices and wafers, which is applied in the manufacture of electrical components, semiconductor/solid-state devices, circuits, etc., and can solve problems such as scratches on the crystal back

Pending Publication Date: 2021-03-26
CHANGXIN MEMORY TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Based on this, it is necessary to provide a wafer cleaning device for the problem that the existing wafer cleaning device is easy to leave scratches on the crystal back during the cleaning process of the crystal back

Method used

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Embodiment Construction

[0026] In order to facilitate understanding of the present application, the present application will be described more fully below with reference to the related drawings. The preferred embodiments of the present application are shown in the accompanying drawings. However, the present application may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that a thorough and complete understanding of the disclosure of this application is provided.

[0027] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for the purp...

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Abstract

The invention relates to a wafer cleaning device. The wafer cleaning device comprises a brush head assembly and a driving assembly. The brush head assembly comprises a first brush head and a second brush head, and the second brush head is arranged around the first brush head with the first brush head as the center. The driving assembly is connected with the first brush head and used for controlling rotation and lifting of the first brush head; the driving assembly is further connected with the second brush head and used for controlling rotation of the second brush head. According to the wafercleaning device, the wafer can be cleaned, and the first brush head can be prevented from scratching the wafer.

Description

technical field [0001] The present application relates to the technical field of semiconductor manufacturing, and in particular, to a wafer cleaning device. Background technique [0002] In the semiconductor manufacturing process, after the wafer is coated, the backside of the wafer may be contaminated with contaminants. If the contaminants on the wafer backside are not cleaned, the wafer may easily cause defocusing or other defects in the lithography process. The existing wafer cleaning device is likely to leave scratches on the wafer back during the cleaning process of the wafer back, causing damage to the wafer. SUMMARY OF THE INVENTION [0003] Based on this, it is necessary to provide a wafer cleaning device for the problem that scratches are easily left on the wafer back during the cleaning process of the wafer back in the existing wafer cleaning device. [0004] A wafer cleaning device, comprising: [0005] a brush head assembly, comprising a first brush head and ...

Claims

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Application Information

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IPC IPC(8): H01L21/67
CPCH01L21/67011H01L21/67023H01L21/6715H01L21/67276
Inventor 罗肖飞
Owner CHANGXIN MEMORY TECH INC
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