Adhesive composition, adhesive film comprising same, backplate film comprising adhesive film, and plastic organic light emitting display comprising adhesive film
A composition, adhesive technology, applied in the direction of adhesive types, organic semiconductor devices, ester copolymer adhesives, etc., can solve the problems of panel damage, increase in adhesive strength, etc.
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[0156]Hereinafter, the present disclosure will be described in detail with reference to embodiments so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms, and is not limited to the embodiments described herein.
preparation example 1
[0158]Polymerization of (meth)acrylate-based resins
[0159]After introducing ethylhexyl acrylate (EHA) / methyl methacrylate (MMA) / N-vinylpyrrolidone (VP) / hydroxyethyl acrylate (HEA) into acetic acid at a weight ratio of 65 / 20 / 5 / 10 After the ethyl ester (EA), azobisisobutyronitrile (AIBN) (thermal polymerization initiator) was introduced therein to prepare a (meth)acrylate-based resin having a weight average molecular weight of 1,000,000 g / mol.
preparation example 2
[0160]Polymerization
[0161]A polymer having the composition and melting temperature of Table 1 below was prepared.
[0162][Table 1]
[0163]
[0164]In Table 1, FM0721 is a monofunctional polysiloxane and a product of Chisso Corporation is used, and FM0721 is a (meth)acrylate in which polysiloxane is present.
[0165]The BHMA and HDA monomers used in Preparations 1 to 3 are monomers that only have Tm characteristics during polymerization and do not exhibit Tg characteristics.
[0166]In Table 1, BHMA is behenyl methacrylate and HDA is cetyl acrylate.
[0167]-Manufacturing of back sheet film
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