Adhesive composition, adhesion film comprising same, backplate film comprising adhesion film, and plastic organic light-emitting display comprising adhesion film
A composition and adhesive technology, applied in the direction of adhesive types, organic semiconductor devices, ester copolymer adhesives, etc., can solve problems such as panel damage and increased adhesive strength
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[0161] Hereinafter, the present disclosure will be described in detail with reference to the embodiments so that those skilled in the art can easily implement the present disclosure. However, the present disclosure can be implemented in various forms, and is not limited to the embodiments described herein.
preparation example 1
[0163] Polymerization of (meth)acrylate-based resin
[0164] After introducing ethylhexyl acrylate (EHA) / methyl methacrylate (MMA) / N-vinylpyrrolidone (VP) / hydroxyethyl acrylate (HEA) into acetic acid at a weight ratio of 65 / 20 / 5 / 10 After ethyl ester (EA), azobisisobutyronitrile (AIBN) (thermal polymerization initiator) was introduced thereinto to prepare a (meth)acrylate-based resin having a weight average molecular weight of 1,000,000 g / mol.
preparation example 2
[0165] Polymerization of Polymer
[0166] Polymers having the compositions and melting temperatures of Table 1 below were prepared.
[0167] [Table 1]
[0168]
[0169] In Table 1, FM0721 is monofunctional polysiloxane and a product of Chisso Corporation is used, and FM0721 is (meth)acrylate in which polysiloxane exists.
[0170] In Table 1, BYK-377 is a structure used as a general additive, and a product of BYK Corporation was used.
[0171] FM0721 is a structure containing polymerizable (meth)acrylate and can react with other monomers, however, BYK-377 is a simple additive that cannot be polymerized.
[0172] In Table 1, BHA is behenyl acrylate, BHMA is behenyl methacrylate, HDA is hexadecyl acrylate, BMA is butyl methacrylate, and STA is stearyl acrylate .
[0173]The BHMA, BHA, STA, BHMA, and HDA monomers used in Preparations 1 to 7 are monomers that have only Tm characteristics when polymerized, and do not exhibit Tg. In addition, the BYK-377 used in Preparation ...
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