Heating protection suction nozzle for wafer repair machine

Abstract

The invention provides a heating protection suction nozzle for a wafer repair machine, the heating protection suction nozzle comprises a micropore suction nozzle with a flow guide groove, a temperature sensor, a heating device and a protective gas circulation device, and the temperature sensor, the heating device and the protective gas circulation device are respectively fixed on the micropore suction nozzle with the flow guide groove. The micropore suction nozzle with the flow guide groove is divided into a head part, a body part and a tail part from bottom to top, and adsorption holes for adsorbing wafers are formed in the head part of the micropore suction nozzle with the flow guide groove. The heating protection suction nozzle has the beneficial effects that the micropore suction nozzle with the flow guide groove can be heated through the heating device, then soldering tin is heated and melted, and therefore damaged wafers are removed. The real-time temperature of the head part ofthe micropore suction nozzle with the flow guide groove can be detected through the temperature sensor, so that constant-temperature control is achieved, and damage to the wafers caused by excess temperature can be avoided. Heated protective gas can be guided to the periphery of the wafers to be welded through the flow guide groove in the micropore suction nozzle, and anti-oxidation protection isconducted on the wafers in the welding process.

Description

technical field [0001] The invention relates to a suction nozzle, in particular to a heating protection suction nozzle for a wafer rework machine. Background technique [0002] When the wafer rework machine replaces wafers (also known as wafers or chips), it needs to heat and melt the solder on the substrate, remove the bad wafers, and then solder new wafers. At present, it mainly relies on ordinary suction nozzles. Removal requires additional heating and melting of solder or mechanical removal. The efficiency is low. Laser heating or hot air heating is also used, which is easy to cause damage to the wafer due to overheating. Moreover, there is a lack of protective gas to protect the welding process. Contents of the invention [0003] In order to solve the problems in the prior art, the invention provides a heating protection suction nozzle for a wafer rework machine. [0004] The invention provides a heating protection suction nozzle for a wafer rework machine, comprisin...

AI Technical Summary

Problems solved by technology

[0002] When the wafer rework machine replaces wafers (also known as wafers or chips), it needs to heat and melt the solder on the substrate, remove the bad wafers, and then solder new wafers. At present, it mainly relies on ordinary suction nozzles. Removal requires additional heating and melting of solder or mechanical removal, which is less efficient, and laser heating or hot air heating is also used, which is easy to cause damage to the wafer due to overheating, and lacks protective gas to protect the welding process

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