A method for preparing layered bismuth oxide selenium semiconductor thin film by reverse air flow method
A technology of semiconductor and bismuth oxide, which is applied in the field of preparation of layered bismuth oxide selenium semiconductor film by reverse air flow method, can solve the problems of uneven nucleation probability of thin layers, reduce the probability of uneven nucleation, broad application prospects, large area effect
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Embodiment 1
[0046] Such as figure 1 As shown, open the first valve 1, the second valve 2, close the third valve 3, and the fourth valve 4. At this time, the air flow flows from the substrate to the growth raw material, which is a reverse air flow; close the first valve 1, the second valve 2, Open the third valve 3 and the fourth valve 4, and at this time, the airflow flows from the growth raw material to the substrate, which is a positive airflow.
[0047] This embodiment provides a method for preparing a layered bismuth oxide selenide semiconductor thin film by a reverse air flow method, which includes the following steps:
[0048] Weigh Bi 2 o 2 1g of Se powder raw material is placed in the center of the quartz tube furnace. Take the mica substrate and place it at the hearth mouth of the quartz tube furnace (i.e. Bi 2 o 2 6 cm downstream of the Se powder feedstock). Pass the carrier gas argon, the airflow is 200 cubic centimeters per minute, and the airflow direction is reverse ai...
Embodiment 2
[0056] This embodiment provides a method for preparing a layered bismuth oxide selenide semiconductor thin film by a reverse air flow method, which includes the following steps:
[0057] Weigh Bi 2 o 2 1g of Se powder raw material is placed in the center of the quartz tube furnace. Take the mica substrate and place it at the hearth mouth of the quartz tube furnace (i.e. Bi 2 o 2 18 cm downstream of the Se powder raw material). Pass the carrier gas argon, the airflow is 100 cubic centimeters per minute, and the airflow direction is reverse airflow at this time, and the tube furnace is heated at the same time, from room temperature to 700 ° C, and kept at 700 ° C for 30 minutes, After the heat preservation is over, adjust the airflow to a positive airflow and deposit for 12 minutes. After the deposition, the temperature is naturally cooled to room temperature to obtain a layered Bi 2 o 2 Se film.
[0058] The pressure of the whole preparation process is normal pressure. ...
Embodiment 3
[0061] This embodiment provides a method for preparing a layered bismuth oxide selenide semiconductor thin film by a reverse air flow method, which includes the following steps:
[0062] Weigh Bi 2 o 2 2g of Se powder raw material is placed in the center of the quartz tube furnace. Take the mica substrate and place it at the hearth mouth of the quartz tube furnace (i.e. Bi 2 o 2 12 cm downstream of the Se powder raw material). Pass the carrier gas argon, the airflow is 175 cubic centimeters per minute, and the airflow direction is reverse airflow at this time, and the tube furnace is heated at the same time, from room temperature to 720 ° C, and kept at 720 ° C for 20 minutes, After the heat preservation is over, adjust the airflow to a positive airflow and deposit for 6 minutes. After the deposition, the temperature is naturally cooled to room temperature to obtain a layered Bi 2 o 2 Se film.
[0063] The pressure of the whole preparation process is normal pressure.
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