Material damage detection method and device

Abstract

The invention provides a material damage detection method and device, and the method comprises the steps: preparing a conductive layer on a material substrate, and enabling the conductive layer to bebroken to the same degree when the surface of the material substrate is broken; introducing current into the conducting layer in at least two different directions, and measuring the variation of the resistance value of the conducting layer in each direction; and calculating the rupture size of the surface of the material matrix according to the variation of the resistance value in each direction.The method and the device achieve high-efficiency and high-precision detection of the fracture and damage conditions of the surface of the material structure body, and are suitable for the surfaces ofvarious detected material matrixes and material matrixes with complex structures and large areas.

Description

technical field [0001] The invention relates to the field of measurement technology, in particular to a material damage detection method and device. Background technique [0002] In order to ensure the normal application of materials as the main components in various occasions, and the requirements for the integrity of material components or structures themselves, especially in aerospace application scenarios, the integrity of material structural parts directly affects the safety and reliability of aircraft. The structural integrity of the material needs to be monitored. [0003] At present, the detection methods for the structural integrity of materials include optical fiber detection, strain gauge detection and other methods. The optical fiber detection method needs to embed the optical fiber inside the material, and the embedded optical fiber will cause a stress concentration area in the material, affect the integrity and continuity of the matrix, and cause a decline in ...

AI Technical Summary

Problems solved by technology

The optical fiber detection method needs to embed the optical fiber inside the material, and the embedded optical fiber will cause a stress concentration area in the material, affect the integrity and continuity of the matrix, and cause a decline in the mechanical properties of the material

The way of pasting the strain gauge can measure the strain / stress of the local point, but limited by the volume of the strain gauge and the way of the lead wire, it cannot cover the entire surface of the material; when a rupture occurs, if the strain gauge is attached to this position, the strain The chip will be broken and invalid

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