Die pressing device for producing digital-to-analog conversion chip

Abstract

The invention discloses a die pressing device for producing a digital-to-analog conversion chip, and relates to the technical field of chip production. The die pressing device for digital-to-analog conversion chip production comprises a lower pressing module and an upper pressing module, the left side of the upper pressing module is movably connected with a driving device, the bottom of the rightside of the driving device is fixedly connected with the lower pressing module, and the right side of the upper pressing module is fixedly connected with a transverse rod. According to the die pressing device for producing a digital-to-analog conversion chip, when the upper pressing module rises to be separated from the lower pressing module, a first baffle pushes a second baffle to rise, a positioning rod is separated from an insertion hole, a scraper automatically pops up leftwards under the action of a driving spring, and the scraper scrapes the bottom of the upper pressing module, so thatthe bottom of the upper pressing module is scraped; therefore, the raw material of the digital-to-analog conversion chip at the bottom of the upper pressing module is scraped off by the scraping plate, the waste of the raw material of the digital-to-analog conversion chip and the pollution in the processing process of the digital-to-analog conversion chip are prevented, and the practicability of the device is improved.

Description

technical field [0001] The invention relates to the technical field of chip production, in particular to a die device for digital-to-analog conversion chip production. Background technique [0002] Integrated circuit English: integrated circuit, abbreviated as IC; or microcircuit (microcircuit), microchip (microchip), chip / chip (chip) is a kind of circuit in electronics (mainly including semiconductor equipment, including passive components) etc.) in a miniaturized manner and are often fabricated on the surface of a semiconductor wafer. [0003] In the production process of the digital-to-analog conversion chip, it is necessary to use a molding device to mold the raw materials, so that the raw materials of the digital-to-analog conversion chip are shaped, and the existing digital-to-analog conversion chip molding device will have part of the digital-to-analog conversion during the molding process. The raw material of the chip adheres to the bottom of the pressing module, an...

AI Technical Summary

Problems solved by technology

[0003] In the production process of the digital-to-analog conversion chip, it is necessary to use a molding device to mold the raw materials, so that the raw materials of the digital-to-analog conversion chip are shaped, and the existing digital-to-analog conversion chip molding device will have part of the digital-to-analog conversion during the molding process. The raw material of the chip adheres to the bottom of the upper pressure module, and there is a waste of raw material for the digital-to-analog conversion chip, which has certain limitations

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