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Large-size silica airgel with ultra-low density and low thermal conductivity and its preparation method

A silicon oxide airgel, ultra-low density technology, applied in chemical instruments and methods, inorganic chemistry, silicon compounds, etc., can solve the problems of poor thermal conductivity, small size, high density of silicon oxide airgel, etc., to achieve Effects of reduced mobility, reduced reaction rate, and concentrated size distribution

Active Publication Date: 2021-08-06
CHANGSHA RONGLAN MACHINERY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The technical problem to be solved by the present invention is to provide large-size silica airgel with ultra-low density and low thermal conductivity and its Preparation

Method used

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  • Large-size silica airgel with ultra-low density and low thermal conductivity and its preparation method
  • Large-size silica airgel with ultra-low density and low thermal conductivity and its preparation method
  • Large-size silica airgel with ultra-low density and low thermal conductivity and its preparation method

Examples

Experimental program
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Effect test

Embodiment 1

[0046] A method for preparing a large-size silica aerogel with ultra-low density and low thermal conductivity, comprising the following steps:

[0047] (1) Preparation of sol precursor a: add silicon source and solvent mixture into the container, stir in a water bath at 30°C for 6 hours, adjust the pH to 3, and form sol precursor a;

[0048] The silicon source is selected from methyl orthosilicate; the solvent mixture is a mixture of ethanol and ethylene glycol, and the amount of ethylene glycol is 0.3 times the mass of ethanol; in the solvent mixture , silicon source: water: the mass ratio of ethanol is 1:4:10; The whole reaction described in step (1) is carried out in water bath;

[0049] (2) Prepare solvent 1: add hydrochloric acid to ethanol, adjust the pH to 2, and obtain solvent 1;

[0050] (3) Prepare mixed solution 2: mix ethanol, water and lye, then add acetylated distarch phosphate equivalent to 0.01% of the mass of lye, stir, adjust pH to 8, and obtain mixed soluti...

Embodiment 2

[0062] A method for preparing a large-size silica aerogel with ultra-low density and low thermal conductivity, comprising the following steps:

[0063] (1) Preparation of sol precursor a: add silicon source and solvent mixture into the container, stir in an oil bath at 40°C for 4 hours, adjust the pH to 5, and form sol precursor a;

[0064] The silicon source is selected from tetraethyl orthosilicate; the solvent mixture is a mixture of ethanol and formamide, and the amount of formamide added is 0.2 times the mass of ethanol; in the solvent mixture, silicon Source: water: the mass ratio of ethanol is 1:4:20; The whole reaction described in step (1) is carried out in oil bath;

[0065] (2) Prepare solvent 1: add hydrochloric acid to ethanol, adjust the pH to 3, and obtain solvent 1;

[0066] (3) Prepare mixed solution 2: mix ethanol, water and lye, add acetylated distarch phosphate equivalent to 0.02% of the mass of lye, stir, adjust pH to 9, and obtain mixed solution 2;

[0...

Embodiment 3

[0078] A method for preparing a large-size silica aerogel with ultra-low density and low thermal conductivity, comprising the following steps:

[0079] (1) Preparation of sol precursor a: add silicon source and solvent mixture into the container, stir in a water bath at 50°C for 3 hours, adjust the pH to 4, and form sol precursor a;

[0080] The silicon source is selected from methyl orthosilicate; the solvent mixture is a mixture of ethanol and oxalic acid, and the acid concentration is 2.1×10 -3 mol / L; In the described solvent mixture, silicon source: water: the mass ratio of ethanol is 1:4:15;

[0081] (2) Prepare solvent 1: add hydrochloric acid to ethanol, adjust the pH to 2, and obtain solvent 1;

[0082] (3) Prepare mixed solution 2: mix ethanol, water and lye, then add acetylated distarch phosphate equivalent to 0.015% of the mass of lye, stir, adjust pH to 10, and obtain mixed solution 2;

[0083] Described lye, sodium hydroxide, the concentration of sodium hydroxid...

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Abstract

The invention discloses a large-size silica airgel with ultra-low density and low thermal conductivity and a preparation method thereof, comprising the following steps: (1) preparing a sol precursor a; (2) preparing a solvent 1; (3) preparing a mixed solution 2 (4) Preparation of sol precursor b; (5) Preparation of silica sol; (6) Preparation of wet gel composite material; (7) Preparation of large-size silica airgel material with ultra-low density and low thermal conductivity. The problem of high density, poor thermal conductivity and small size of the existing silica airgel is solved.

Description

technical field [0001] The invention belongs to the technical field of airgel preparation, and in particular relates to a large-size silica airgel with ultra-low density and low thermal conductivity and a preparation method thereof. Background technique [0002] The airship is a low-speed aircraft that can fly in the stratosphere for a long time. It has the advantages of continuous power propulsion, fixed-point controllable flight, long stay in the air, strong load capacity and high cost-effectiveness. The commonly used stratospheric airship energy system uses flexible thin-film solar cells, which have the characteristics of high technical maturity, high photoelectric conversion efficiency, and can be customized according to the shape. When flexible solar cells are used to power the airship, the working state The surface temperature of the flexible solar panel can reach 150-180°C. If it is not insulated, other instruments and equipment on the back of the panel will be burned...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C01B33/158C01B33/145
CPCC01B33/145C01B33/1585C01P2004/01C01P2004/61C01P2006/10C01P2006/32
Inventor 杨斌高庆福熊熙李勇阳立芬宋月宝
Owner CHANGSHA RONGLAN MACHINERY
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