Lead frame of high-power driving circuit and production method

Abstract

The invention discloses a lead frame of a high-power drive circuit and a production method, and the lead frame comprises a lead frame main body, a splicing assembly is fixed in one side of the lead frame main body, and a heat dissipation assembly is fixed outside one side of the lead frame main body; the splicing assembly comprises clamping blocks distributed and welded to the side face of one side of the lead frame body, clamping grooves corresponding to the clamping blocks are distributed in one side of the lead frame body, a moving groove is formed in one side of the lead frame body, and aconnecting plate is installed in one side of the moving groove. According to the invention, splicing operation can be rapidly carried out, so that a plurality of lead frame main bodies are fixedly connected, the welding operation can be reduced, a lot of harmful gases are prevented from being generated in the welding process, the environment can be effectively protected, the human health is protected, the potential safety hazard is reduced, and continuous heat conduction and heat dissipation can be carried out; the heat in the lead frame main body is rapidly dissipated, and the heat dissipation efficiency is improved.

Description

technical field [0001] The invention belongs to the technical field of lead frame equipment, in particular to a lead frame of a high-power drive circuit and a production method thereof. Background technique [0002] The drive circuit is located between the main circuit and the control circuit, and the intermediate circuit used to amplify the signal of the control circuit (that is, to amplify the signal of the control circuit so that it can drive the power transistor) is called the drive circuit; and the function of the drive circuit: The PWM pulse output by the control circuit is amplified enough to drive the power transistor - the switching power amplification function, and the high-power drive circuit is also one of them, and the high-power drive circuit usually uses a lead frame when used, and the lead frame is used as an integrated circuit chip The carrier is a key structural part that realizes the electrical connection between the lead-out end of the chip's internal cir...

AI Technical Summary

Problems solved by technology

[0003] However, the metal blocks on the existing lead frames are generally fixed by welding, so that in the process of welding, a lot of harmful gases will be produced, which will not only pollute the weather, but also affect the health of welders, increasing the production process. security risks;

[0004] When the lead frame is used, a lot of heat will be generated. If the temperature is not cooled in time, it will easily affect the chip or electronic module and affect its use.

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