Stacked package with ground ring and method of processing the same

Abstract

The invention discloses a stacking package with a grounding ring and a processing method thereof. A hinged ferrule, a connecting plate, a grounding ring, a second receiving slot and a rotating shaft, an inner wall of one side of the main body of the package is provided with a mounting slot, and a motor is distributed and mounted on the inner wall of the bottom end of the mounting slot. Gears are installed on the inner wall of one side of the installation slot, and one end of the output shaft of the motor is fixed to the inside of the gear. The outer wall of one side of the gear is meshed and connected with a rack. The invention adopts the method of grounding ring to reduce ground The connection of the wire facilitates the installation and fixation of the chip, reduces the space of the package, and facilitates the installation of the grounding ring, reduces the welding operation, avoids the generation of a large amount of harmful gas during welding, prevents environmental pollution, and improves the safety of the package.

Description

technical field [0001] The invention belongs to the technical field of package equipment, in particular to a stacked package with a ground ring and a processing method thereof. Background technique [0002] Since the 1980s, electronic products have developed in the direction of multi-functionality, lightness, thinness, and compactness, which has put forward requirements for high-speed and high-density packaging technology, so stack packaging has been developed, and grounding refers to the neutral point of power systems and electrical devices, electrical equipment. The exposed conductive part and the external conductive part of the device are connected to the earth through conductors; they can be divided into working grounding, lightning protection grounding and protective grounding, and the grounding ring is one of them. [0003] However, the existing stacking package is generally connected with a ground wire, which makes it inconvenient to bond the ground wire when the chip...

AI Technical Summary

Problems solved by technology

[0003] However, the existing stacked package is generally connected with a ground wire, so that when the chip is large, it is not convenient to bond the ground wire, and it is easy to expand the range of bonding wires, and when the chip size is small, it is easy to produce a separation area, resulting in a shortage of wiring space. Waste, so when operating, you need to pay attention to the size of the chip and the connection range with the ground wire, which indirectly increases the burden on the staff

Images