Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Processing mechanism of integrated circuit board

A technology for integrated circuit boards and processing mechanisms, which is applied in the directions of printed circuits, printed circuit manufacturing, electrical components, etc., can solve the problems of insufficient drilling operation accuracy, waste of manpower, etc., and achieve the effect of facilitating the fixed installation of circuit boards.

Inactive Publication Date: 2020-12-25
刘玉
View PDF0 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the development of industrial technology, modern industrial technology tends to be more and more artificial intelligence. Modern PLC technology needs to use a lot of integrated circuit boards. The production material of the circuit board is a plate, and the circuit board needs to be finished. , It is also necessary to perform drilling and other operations on the corresponding redundant parts for subsequent installation of electronic components. For those circuit boards with special requirements, it is necessary to open holes and slots on the circuit board, and open holes on the circuit board Usually, the staff punches a through hole on the circuit board, which is a waste of manpower, and the accuracy of the hole opening operation is not enough

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Processing mechanism of integrated circuit board
  • Processing mechanism of integrated circuit board
  • Processing mechanism of integrated circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] refer to Figures 1 to 8 The processing mechanism of a kind of integrated circuit board shown, comprises fixed guide rail 1, and described fixed guide rail 1 is provided with two altogether, and fixed guide rail 1 is fixedly installed, and described fixed guide rail 1 is equipped with slider 2, and slider 2 and the fixed guide rail 1 are slidingly connected, and the tops of the two sliders 2 are jointly fixed with a clamping assembly 3. The clamping assembly 3 includes a sliding plate 301, and the opposite sides of the sliding plate 301 are respectively fixed to the tops of the two sliding blocks 2. On the surface, the opposite sides of the upper surface of the sliding board 301 are fixedly equipped with first fixed hinge blocks 302, one side of each first fixed hinge block 302 is equipped with a rotating frame 303, and the middle of the rotating frame 303 is provided with a second A round rod matching the fixed hinge block 302, two pressure springs 304 are arranged on ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a processing mechanism of an integrated circuit board, which belongs to the field of circuit board processing. The mechanism comprises two fixed guide rails, the fixed guide rails are fixedly mounted, sliding blocks are mounted on the fixed guide rails, the sliding blocks are slidably connected with the fixed guide rails, and clamping assemblies are fixedly mounted at the top ends of the sliding blocks. Each clamping assembly comprises a sliding plate, the bottom face of the sliding plate is attached to the top face of the sliding block, first fixed hinge blocks are fixedly installed on the two sides of the sliding plate, a rotating frame is installed on one sides of the first fixed hinge blocks, and a round rod matched with the first fixed hinge blocks is arrangedin the middle of the rotating frame. Two pressure springs are arranged at the bottom end of each rotating frame and connected with the top faces of the sliding plates, a ball head is arranged at the end of an output rod and attached to the side face of a push piece, and a positioning push rod is installed at the bottom end of each sliding plate. The integrated circuit board processing mechanism ishigh in trepanning efficiency and high in machining precision for the integrated circuit board.

Description

technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a processing mechanism for an integrated circuit board. Background technique [0002] With the development of industrial technology, modern industrial technology tends to be more and more artificial intelligence. Modern PLC technology needs to use a lot of integrated circuit boards. The production material of the circuit board is a plate, and the circuit board needs to be finished. , It is also necessary to perform drilling and other operations on the corresponding redundant parts for subsequent installation of electronic components. For those circuit boards with special requirements, it is necessary to open holes and slots on the circuit board, and open holes on the circuit board Usually, the staff punches a through hole on the circuit board, which is a waste of manpower, and the accuracy of the hole opening operation is not enough. Contents of the invention ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K3/0044H05K3/0047
Inventor 刘玉
Owner 刘玉
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products