Manufacturing method of packaging structure

Abstract

The invention discloses a manufacturing method of a packaging structure, and the method comprises the following steps: S1, carrying out the back grinding of a wafer from a wafer factory through wafergrinding equipment, so as to reduce the thickness of the wafer to a thickness required by packaging; pasting an adhesive tape on the front surface of the wafer to protect a circuit area and grinding the back surface at the same time during wafer grinding; after grinding, removing the adhesive tape, and measuring the thickness of the wafer; pasting the thinned chip on a thin film with a metal ring,and sending the thin film to a scribing machine for scribing; S2, after scribing is completed, mounting and pasting the wafer on the blue film, so the wafer does not scatter even if the wafer is cutoff; and cutting the whole wafer into independent chips one by one through wafer cutting. The method is low in cost, and the economic benefit can be greatly improved; meanwhile, in the packaging process, the silicon wafer polishing effect is good, and dust pollution can be effectively reduced; moreover, the packaging structure is processed, so that the overall quality of the packaging structure can be greatly improved.

Description

technical field [0001] The invention relates to the technical field of chip packaging, in particular to a method for manufacturing a packaging structure. Background technique [0002] After the chip is processed, due to the small size and thinness of the chip, it will be easily scratched and damaged if no external protection is applied. Moreover, because the size of the chip is small, it is not easy to manually place it on the circuit board; The circuit pins of the circuit are connected to the external joints with wires so as to be connected with other devices; the packaged product is called a package structure; the production method of the package structure in the prior art, in the process of processing, the production cost is relatively high, As a result, the economic benefit is low; moreover, there are flaws such as burrs on the surface of the packaged structure, which can easily affect the overall quality of the packaged structure; at the same time, a large amount of dus...

AI Technical Summary

Problems solved by technology

[0002] After the chip is processed, due to the small size and thinness of the chip, it will be easily scratched and damaged if no external protection is applied. Moreover, because the size of the chip is small, it is not easy to manually place it on the circuit board; The circuit pins of the circuit are connected to the external joints with wires so as to be connected with other devices; the packaged product is called a package structure; the production method of the package structure in the prior art, in the process of processing, the production cost is relatively high, As a result, the economic benefit is low; moreover, there are flaws such as burrs on the surface of the packaged structure, which can easily affect the overall quality of the packaged structure; at the same time, a large amount of dust pollution will be generated during the polishing process of the silicon wafer, which is inconvenient to clean. Therefore, It is necessary to design a manufacturing method of the packaging structure

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